K6T4008C1B-GF55 vs M5M5408BFP-55HI feature comparison

K6T4008C1B-GF55 Samsung Semiconductor

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M5M5408BFP-55HI Renesas Electronics Corporation

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Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer SAMSUNG SEMICONDUCTOR INC RENESAS ELECTRONICS CORP
Part Package Code SOIC SOIC
Package Description 0.525 INCH, PLASTIC, SOP-32 0.525 INCH, PLASTIC, SOP-32
Pin Count 32 32
Reach Compliance Code compliant unknown
ECCN Code 3A991.B.2.A 3A991.B.2.A
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 55 ns 55 ns
I/O Type COMMON COMMON
JESD-30 Code R-PDSO-G32 R-PDSO-G32
JESD-609 Code e0
Length 20.47 mm
Memory Density 4194304 bit 4194304 bit
Memory IC Type STANDARD SRAM STANDARD SRAM
Memory Width 8 8
Number of Functions 1 1
Number of Terminals 32 32
Number of Words 524288 words 524288 words
Number of Words Code 512000 512000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Organization 512KX8 512KX8
Output Characteristics 3-STATE 3-STATE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP SOP
Package Equivalence Code SOP32,.56 SOP32,.56
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Seated Height-Max 3 mm
Standby Voltage-Min 2 V 2 V
Supply Current-Max 0.08 mA 0.09 mA
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish TIN LEAD
Terminal Form GULL WING GULL WING
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position DUAL DUAL
Width 11.43 mm
Base Number Matches 1 2
Standby Current-Max 0.00003 A

Compare K6T4008C1B-GF55 with alternatives

Compare M5M5408BFP-55HI with alternatives