K9F1G08U0D-HCB00 vs S34ML01G200TFV000 feature comparison

K9F1G08U0D-HCB00 Samsung Semiconductor

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S34ML01G200TFV000 SkyHigh Memory Limited

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Rohs Code Yes Yes
Part Life Cycle Code Obsolete Contact Manufacturer
Ihs Manufacturer SAMSUNG SEMICONDUCTOR INC SKYHIGH MEMORY LTD
Part Package Code BGA
Package Description 9 X 11 MM, 0.80 MM PITCH, LEAD FREE, FBGA-63 TSOP1,
Pin Count 63
Reach Compliance Code unknown compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.51 8542.32.00.51
Access Time-Max 20 ns 25 ns
Additional Feature CONTAINS ADDITIONAL 32M BIT NAND FLASH
Command User Interface YES YES
Data Polling NO YES
JESD-30 Code R-PBGA-B63 R-PDSO-G48
Length 11 mm 18.4 mm
Memory Density 1073741824 bit 1073741824 bit
Memory IC Type FLASH FLASH
Memory Width 8 8
Number of Functions 1 1
Number of Sectors/Size 1K 1024
Number of Terminals 63 48
Number of Words 134217728 words 134217728 words
Number of Words Code 128000000 128000000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 70 °C 105 °C
Operating Temperature-Min -40 °C
Organization 128MX8 128MX8
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code VFBGA TSSOP
Package Equivalence Code BGA63,10X12,32 TSSOP48,.8,20
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY, VERY THIN PROFILE, FINE PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Page Size 2K words 2K words
Parallel/Serial PARALLEL PARALLEL
Programming Voltage 2.7 V 3 V
Qualification Status Not Qualified
Ready/Busy YES YES
Seated Height-Max 1 mm 1.2 mm
Sector Size 128K 128K
Standby Current-Max 0.00008 A 0.00005 A
Supply Current-Max 0.035 mA 0.03 mA
Supply Voltage-Max (Vsup) 3.6 V 3.6 V
Supply Voltage-Min (Vsup) 2.7 V 2.7 V
Supply Voltage-Nom (Vsup) 3.3 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL INDUSTRIAL
Terminal Form BALL GULL WING
Terminal Pitch 0.8 mm 0.5 mm
Terminal Position BOTTOM DUAL
Toggle Bit NO YES
Type SLC NAND TYPE SLC NAND TYPE
Width 9 mm 12 mm
Base Number Matches 1 2
Data Retention Time-Min 10
JESD-609 Code e3
Moisture Sensitivity Level 3
Peak Reflow Temperature (Cel) 260
Terminal Finish MATTE TIN
Write Cycle Time-Max (tWC) 0.000025 ms

Compare K9F1G08U0D-HCB00 with alternatives

Compare S34ML01G200TFV000 with alternatives