KA358D
vs
LM358N
feature comparison
| Part Life Cycle Code |
Transferred
|
Transferred
|
| Ihs Manufacturer |
SAMSUNG SEMICONDUCTOR INC
|
RCA SOLID STATE
|
| Part Package Code |
SOIC
|
|
| Package Description |
0.225 INCH, SOP-8
|
DIP, DIP8,.3
|
| Pin Count |
8
|
|
| Reach Compliance Code |
compliant
|
unknown
|
| ECCN Code |
EAR99
|
|
| HTS Code |
8542.33.00.01
|
|
| Amplifier Type |
OPERATIONAL AMPLIFIER
|
OPERATIONAL AMPLIFIER
|
| Architecture |
VOLTAGE-FEEDBACK
|
VOLTAGE-FEEDBACK
|
| Average Bias Current-Max (IIB) |
0.5 µA
|
|
| Bias Current-Max (IIB) @25C |
0.25 µA
|
|
| Common-mode Reject Ratio-Nom |
80 dB
|
|
| Frequency Compensation |
YES
|
YES
|
| Input Offset Voltage-Max |
9000 µV
|
9000 µV
|
| JESD-30 Code |
R-PDSO-G8
|
R-PDIP-T8
|
| Length |
4.9 mm
|
|
| Low-Offset |
NO
|
NO
|
| Neg Supply Voltage Limit-Max |
-16 V
|
|
| Number of Functions |
2
|
2
|
| Number of Terminals |
8
|
8
|
| Operating Temperature-Max |
70 °C
|
70 °C
|
| Operating Temperature-Min |
|
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
SOP
|
DIP
|
| Package Equivalence Code |
SOP8,.25
|
DIP8,.3
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE
|
IN-LINE
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
1.95 mm
|
|
| Supply Current-Max |
2 mA
|
|
| Supply Voltage Limit-Max |
16 V
|
|
| Supply Voltage-Nom (Vsup) |
5 V
|
|
| Surface Mount |
YES
|
NO
|
| Technology |
BIPOLAR
|
BIPOLAR
|
| Temperature Grade |
COMMERCIAL
|
COMMERCIAL
|
| Terminal Form |
GULL WING
|
THROUGH-HOLE
|
| Terminal Pitch |
1.27 mm
|
2.54 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Voltage Gain-Min |
15000
|
|
| Width |
3.9 mm
|
|
| Base Number Matches |
3
|
18
|
| Rohs Code |
|
No
|
| JESD-609 Code |
|
e0
|
| Power Supplies |
|
+-1.5/+-15/3/30 V
|
| Terminal Finish |
|
Tin/Lead (Sn/Pb)
|
|
|
|
Compare KA358D with alternatives