KGA4153
vs
M02016-XX
feature comparison
| Rohs Code |
Yes
|
No
|
| Part Life Cycle Code |
Transferred
|
Transferred
|
| Ihs Manufacturer |
LAPIS SEMICONDUCTOR CO LTD
|
MINDSPEED TECHNOLOGIES INC
|
| Part Package Code |
DIE
|
|
| Package Description |
DIE, DIE OR CHIP
|
DIE, DIE OR CHIP
|
| Reach Compliance Code |
unknown
|
compliant
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| JESD-30 Code |
R-XUUC-N
|
R-XUUC-N12
|
| Number of Functions |
1
|
1
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-10 °C
|
-40 °C
|
| Package Body Material |
UNSPECIFIED
|
UNSPECIFIED
|
| Package Code |
DIE
|
DIE
|
| Package Equivalence Code |
DIE OR CHIP
|
DIE OR CHIP
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
UNCASED CHIP
|
UNCASED CHIP
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Supply Current-Max |
0.08 mA
|
0.039 mA
|
| Supply Voltage-Nom |
3.3 V
|
3.3 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
GAAS
|
CMOS
|
| Telecom IC Type |
TELECOM CIRCUIT
|
TELECOM CIRCUIT
|
| Temperature Grade |
OTHER
|
INDUSTRIAL
|
| Terminal Form |
NO LEAD
|
NO LEAD
|
| Terminal Position |
UPPER
|
UPPER
|
| Base Number Matches |
1
|
1
|
| Pbfree Code |
|
No
|
| Number of Terminals |
|
12
|
| Peak Reflow Temperature (Cel) |
|
NOT SPECIFIED
|
| Time@Peak Reflow Temperature-Max (s) |
|
NOT SPECIFIED
|
|
|
|