KS5513C
vs
MC141624SP
feature comparison
| Rohs Code |
No
|
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
SAMSUNG SEMICONDUCTOR INC
|
MOTOROLA INC
|
| Part Package Code |
DIP
|
|
| Package Description |
SDIP, SDIP32,.4
|
DIP,
|
| Pin Count |
32
|
|
| Reach Compliance Code |
compliant
|
unknown
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Consumer IC Type |
SYNC SEPARATOR IC
|
Y/C SEPARATOR IC
|
| JESD-30 Code |
R-PDIP-T32
|
R-PDIP-T32
|
| JESD-609 Code |
e0
|
|
| Length |
29.4 mm
|
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
32
|
32
|
| Operating Temperature-Max |
70 °C
|
75 °C
|
| Operating Temperature-Min |
-20 °C
|
-20 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
SDIP
|
DIP
|
| Package Equivalence Code |
SDIP32,.4
|
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
IN-LINE, SHRINK PITCH
|
IN-LINE
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
5.08 mm
|
|
| Supply Current-Max |
25 mA
|
|
| Supply Voltage-Max (Vsup) |
5.25 V
|
5.25 V
|
| Supply Voltage-Min (Vsup) |
4.75 V
|
4.75 V
|
| Surface Mount |
NO
|
NO
|
| Technology |
BICMOS
|
CMOS
|
| Temperature Grade |
COMMERCIAL
|
COMMERCIAL EXTENDED
|
| Terminal Finish |
Tin/Lead (Sn/Pb)
|
|
| Terminal Form |
THROUGH-HOLE
|
THROUGH-HOLE
|
| Terminal Pitch |
1.778 mm
|
|
| Terminal Position |
DUAL
|
DUAL
|
| Width |
10.16 mm
|
|
| Base Number Matches |
1
|
1
|
|
|
|