KS5513C
vs
CXD2073Q
feature comparison
Rohs Code |
No
|
|
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
SAMSUNG SEMICONDUCTOR INC
|
SONY CORP
|
Part Package Code |
DIP
|
QFP
|
Package Description |
SDIP, SDIP32,.4
|
QFP, QFP32,.35SQ,32
|
Pin Count |
32
|
32
|
Reach Compliance Code |
compliant
|
unknown
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Consumer IC Type |
SYNC SEPARATOR IC
|
Y/C SEPARATOR IC
|
JESD-30 Code |
R-PDIP-T32
|
S-PQFP-G32
|
JESD-609 Code |
e0
|
|
Length |
29.4 mm
|
7 mm
|
Number of Functions |
1
|
1
|
Number of Terminals |
32
|
32
|
Operating Temperature-Max |
70 °C
|
75 °C
|
Operating Temperature-Min |
-20 °C
|
-20 °C
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
SDIP
|
QFP
|
Package Equivalence Code |
SDIP32,.4
|
QFP32,.35SQ,32
|
Package Shape |
RECTANGULAR
|
SQUARE
|
Package Style |
IN-LINE, SHRINK PITCH
|
FLATPACK
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
5.08 mm
|
1.85 mm
|
Supply Current-Max |
25 mA
|
60 mA
|
Supply Voltage-Max (Vsup) |
5.25 V
|
5.25 V
|
Supply Voltage-Min (Vsup) |
4.75 V
|
4.75 V
|
Surface Mount |
NO
|
YES
|
Technology |
BICMOS
|
CMOS
|
Temperature Grade |
COMMERCIAL
|
COMMERCIAL EXTENDED
|
Terminal Finish |
Tin/Lead (Sn/Pb)
|
|
Terminal Form |
THROUGH-HOLE
|
GULL WING
|
Terminal Pitch |
1.778 mm
|
0.8 mm
|
Terminal Position |
DUAL
|
QUAD
|
Width |
10.16 mm
|
7 mm
|
Base Number Matches |
1
|
1
|
|
|
|