KS82C37A-8CP vs 5962-9054301MXA feature comparison

KS82C37A-8CP Samsung Semiconductor

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5962-9054301MXA Intersil Corporation

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Pbfree Code No
Rohs Code No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer SAMSUNG SEMICONDUCTOR INC INTERSIL CORP
Part Package Code DIP DIE
Package Description DIP, DIP40,.6 DIE,
Pin Count 40 40
Reach Compliance Code compliant unknown
HTS Code 8542.31.00.01 8542.31.00.01
Address Bus Width 8 8
Bus Compatibility 8080; 8085; 8086; 8088; 80186; 80286; 80386 80C286; 80286; 80186; 80C86; 8086; 80C88; 8088; 8085; Z80; NSC800
Clock Frequency-Max 8 MHz 5 MHz
External Data Bus Width 8 8
JESD-30 Code R-PDIP-T40 X-XUUC-N40
JESD-609 Code e0 e0
Length 52.197 mm 16.535 mm
Number of DMA Channels 4 4
Number of Terminals 40 40
Operating Temperature-Max 70 °C 125 °C
Operating Temperature-Min -55 °C
Package Body Material PLASTIC/EPOXY UNSPECIFIED
Package Code DIP DIE
Package Equivalence Code DIP40,.6
Package Shape RECTANGULAR UNSPECIFIED
Package Style IN-LINE UNCASED CHIP
Qualification Status Not Qualified Not Qualified
Seated Height-Max 5.08 mm 3.05 mm
Supply Current-Max 16 mA
Supply Voltage-Max 6 V 5.5 V
Supply Voltage-Min 4 V 4.5 V
Supply Voltage-Nom 5 V 5 V
Surface Mount NO YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL MILITARY
Terminal Finish TIN LEAD TIN LEAD
Terminal Form THROUGH-HOLE NO LEAD
Terminal Pitch 2.54 mm 1.27 mm
Terminal Position DUAL UPPER
Width 15.24 mm 16.535 mm
uPs/uCs/Peripheral ICs Type DMA CONTROLLER DMA CONTROLLER
Base Number Matches 1 1
ECCN Code 3A001.A.2.C
Screening Level MIL-STD-883 Class B

Compare KS82C37A-8CP with alternatives

Compare 5962-9054301MXA with alternatives