KS8805B
vs
935220650512
feature comparison
Pbfree Code |
No
|
|
Rohs Code |
No
|
|
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
SAMSUNG SEMICONDUCTOR INC
|
NXP SEMICONDUCTORS
|
Package Description |
SOP, DIP16,.3
|
SOP,
|
Reach Compliance Code |
compliant
|
unknown
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
JESD-30 Code |
R-PDSO-G14
|
R-PDSO-G14
|
JESD-609 Code |
e0
|
|
Number of Functions |
1
|
1
|
Number of Terminals |
14
|
14
|
Operating Temperature-Max |
75 °C
|
75 °C
|
Operating Temperature-Min |
-30 °C
|
-25 °C
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
SOP
|
SOP
|
Package Equivalence Code |
DIP16,.3
|
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
SMALL OUTLINE
|
SMALL OUTLINE
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Supply Current-Max |
0.007 mA
|
1.4 mA
|
Supply Voltage-Nom |
3 V
|
2.9 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
BIPOLAR
|
Telecom IC Type |
CORDLESS TELEPHONE SUPPORT CIRCUIT
|
CORDLESS TELEPHONE BASEBAND CIRCUIT
|
Temperature Grade |
COMMERCIAL EXTENDED
|
COMMERCIAL EXTENDED
|
Terminal Finish |
TIN LEAD
|
|
Terminal Form |
GULL WING
|
GULL WING
|
Terminal Pitch |
2.54 mm
|
1.27 mm
|
Terminal Position |
DUAL
|
DUAL
|
Base Number Matches |
1
|
1
|
Part Package Code |
|
SOIC
|
Pin Count |
|
14
|
Length |
|
8.65 mm
|
Seated Height-Max |
|
1.75 mm
|
Width |
|
3.9 mm
|
|
|
|
Compare KS8805B with alternatives
Compare 935220650512 with alternatives