KSZ8041TLI-S
vs
KSZ8041NLJ
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Active
|
Obsolete
|
| Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
MICROCHIP TECHNOLOGY INC
|
| Package Description |
TFQFP,
|
5 X 5 MM, LEAD FREE, MLF-32
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8517.70.00.00
|
8542.39.00.01
|
| Factory Lead Time |
4 Weeks
|
|
| Samacsys Manufacturer |
Microchip
|
Microchip
|
| Data Rate |
100000 Mbps
|
100000 Mbps
|
| JESD-30 Code |
S-PQFP-G48
|
S-XQCC-N32
|
| JESD-609 Code |
e3
|
e3
|
| Length |
7 mm
|
5 mm
|
| Moisture Sensitivity Level |
3
|
2
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
48
|
32
|
| Number of Transceivers |
1
|
1
|
| Operating Temperature-Max |
85 °C
|
125 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
UNSPECIFIED
|
| Package Code |
TFQFP
|
HVQCCN
|
| Package Equivalence Code |
TQFP48,.35SQ
|
LCC32,.2SQ,20
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
FLATPACK, THIN PROFILE, FINE PITCH
|
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
| Peak Reflow Temperature (Cel) |
260
|
260
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Screening Level |
TS 16949
|
TS 16949
|
| Seated Height-Max |
1.2 mm
|
0.9 mm
|
| Supply Current-Max |
58.3 mA
|
|
| Supply Voltage-Nom |
3.3 V
|
3.3 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Telecom IC Type |
ETHERNET TRANSCEIVER
|
ETHERNET TRANSCEIVER
|
| Temperature Grade |
INDUSTRIAL
|
AUTOMOTIVE
|
| Terminal Finish |
MATTE TIN
|
MATTE TIN
|
| Terminal Form |
GULL WING
|
NO LEAD
|
| Terminal Pitch |
0.5 mm
|
0.5 mm
|
| Terminal Position |
QUAD
|
QUAD
|
| Width |
7 mm
|
5 mm
|
| Base Number Matches |
1
|
1
|
| Time@Peak Reflow Temperature-Max (s) |
|
30
|
|
|
|
Compare KSZ8041TLI-S with alternatives
Compare KSZ8041NLJ with alternatives