KSZ8895FQXITR
vs
KSZ9563RNXI-TR
feature comparison
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
MICROCHIP TECHNOLOGY INC
|
| Package Description |
FQFP,
|
HVQCCN,
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Date Of Intro |
2016-08-12
|
2018-02-16
|
| JESD-30 Code |
R-PQFP-G128
|
S-PQCC-N64
|
| JESD-609 Code |
e3
|
e3
|
| Length |
20 mm
|
8 mm
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
128
|
64
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
FQFP
|
HVQCCN
|
| Package Equivalence Code |
QFP128,.68X.91,20
|
LCC64,.32SQ,16
|
| Package Shape |
RECTANGULAR
|
SQUARE
|
| Package Style |
FLATPACK, FINE PITCH
|
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
| Seated Height-Max |
3.4 mm
|
0.9 mm
|
| Supply Voltage-Nom |
1.2 V
|
1.2 V
|
| Surface Mount |
YES
|
YES
|
| Telecom IC Type |
ETHERNET SWITCH
|
ETHERNET SWITCH
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Finish |
MATTE TIN
|
MATTE TIN
|
| Terminal Form |
GULL WING
|
NO LEAD
|
| Terminal Pitch |
0.5 mm
|
0.4 mm
|
| Terminal Position |
QUAD
|
QUAD
|
| Width |
14 mm
|
8 mm
|
| Base Number Matches |
2
|
1
|
| Factory Lead Time |
|
8 Weeks
|
| Samacsys Manufacturer |
|
Microchip
|
| Moisture Sensitivity Level |
|
3
|
| Peak Reflow Temperature (Cel) |
|
260
|
| Time@Peak Reflow Temperature-Max (s) |
|
30
|
|
|
|
Compare KSZ8895FQXITR with alternatives
Compare KSZ9563RNXI-TR with alternatives