KSZ8895MQXC-TR
vs
LAN9353/ML
feature comparison
Part Life Cycle Code |
Active
|
Active
|
Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
MICROCHIP TECHNOLOGY INC
|
Package Description |
FQFP,
|
HVQCCN,
|
Reach Compliance Code |
compliant
|
compliant
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Factory Lead Time |
4 Weeks
|
5 Weeks
|
Samacsys Manufacturer |
Microchip
|
Microchip
|
JESD-30 Code |
R-PQFP-G128
|
S-XQCC-N64
|
JESD-609 Code |
e3
|
e3
|
Length |
20 mm
|
9 mm
|
Number of Functions |
1
|
1
|
Number of Terminals |
128
|
64
|
Operating Temperature-Max |
70 °C
|
70 °C
|
Operating Temperature-Min |
|
|
Package Body Material |
PLASTIC/EPOXY
|
UNSPECIFIED
|
Package Code |
FQFP
|
HVQCCN
|
Package Equivalence Code |
QFP128,.68X.91,20
|
LCC64,.35SQ,20
|
Package Shape |
RECTANGULAR
|
SQUARE
|
Package Style |
FLATPACK, FINE PITCH
|
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
Seated Height-Max |
3.4 mm
|
1 mm
|
Supply Voltage-Nom |
1.2 V
|
3.3 V
|
Surface Mount |
YES
|
YES
|
Telecom IC Type |
ETHERNET SWITCH
|
ETHERNET SWITCH
|
Temperature Grade |
COMMERCIAL
|
INDUSTRIAL
|
Terminal Finish |
MATTE TIN
|
MATTE TIN
|
Terminal Form |
GULL WING
|
NO LEAD
|
Terminal Pitch |
0.5 mm
|
0.5 mm
|
Terminal Position |
QUAD
|
QUAD
|
Width |
14 mm
|
9 mm
|
Base Number Matches |
1
|
1
|
Rohs Code |
|
Yes
|
Moisture Sensitivity Level |
|
3
|
Peak Reflow Temperature (Cel) |
|
260
|
Screening Level |
|
TS 16949
|
Time@Peak Reflow Temperature-Max (s) |
|
40
|
|
|
|
Compare KSZ8895MQXC-TR with alternatives
Compare LAN9353/ML with alternatives