KSZ8995FQ-TR
vs
KSZ8995FQ
feature comparison
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
MICROCHIP TECHNOLOGY INC
|
| Package Description |
LEAD FREE, PLASTIC,QFP-128
|
QFP-128
|
| Reach Compliance Code |
compliant
|
compliant
|
| HTS Code |
8542.39.00.01
|
8517.70.00.00
|
| JESD-30 Code |
R-PQFP-G128
|
R-PQFP-G128
|
| Length |
20 mm
|
20 mm
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
128
|
128
|
| Operating Temperature-Max |
70 °C
|
70 °C
|
| Operating Temperature-Min |
|
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
FQFP
|
FQFP
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
FLATPACK, FINE PITCH
|
FLATPACK, FINE PITCH
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Seated Height-Max |
3.4 mm
|
3.4 mm
|
| Supply Voltage-Nom |
1.8 V
|
1.8 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Telecom IC Type |
LAN SWITCHING CIRCUIT
|
ETHERNET SWITCH
|
| Temperature Grade |
COMMERCIAL
|
COMMERCIAL
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
0.5 mm
|
0.5 mm
|
| Terminal Position |
QUAD
|
QUAD
|
| Time@Peak Reflow Temperature-Max (s) |
40
|
|
| Width |
14 mm
|
14 mm
|
| Base Number Matches |
1
|
1
|
| Rohs Code |
|
Yes
|
| ECCN Code |
|
EAR99
|
| Factory Lead Time |
|
9 Weeks
|
| Samacsys Manufacturer |
|
Microchip
|
| JESD-609 Code |
|
e3
|
| Package Equivalence Code |
|
QFP128,.68X.91,20
|
| Supply Current-Max |
|
230 mA
|
| Terminal Finish |
|
MATTE TIN
|
|
|
|
Compare KSZ8995FQ-TR with alternatives
Compare KSZ8995FQ with alternatives