KSZ9031MNXCA
vs
VSC8574XKS-05
feature comparison
| Rohs Code |
Yes
|
|
| Part Life Cycle Code |
Active
|
Transferred
|
| Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
MICROSEMI CORP
|
| Reach Compliance Code |
compliant
|
compliant
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Date Of Intro |
2016-02-19
|
|
| Samacsys Manufacturer |
Microchip
|
Microsemi Corporation
|
| Data Rate |
1000000 Mbps
|
|
| JESD-30 Code |
S-XQCC-N64
|
S-PBGA-B256
|
| JESD-609 Code |
e3
|
|
| Length |
8 mm
|
17 mm
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
64
|
256
|
| Number of Transceivers |
1
|
|
| Operating Temperature-Max |
70 °C
|
|
| Operating Temperature-Min |
|
|
| Package Body Material |
UNSPECIFIED
|
PLASTIC/EPOXY
|
| Package Code |
HVQCCN
|
BGA
|
| Package Equivalence Code |
LCC64,.32SQ,16
|
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
GRID ARRAY
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Seated Height-Max |
0.9 mm
|
1.8 mm
|
| Supply Voltage-Nom |
1.2 V
|
1 V
|
| Surface Mount |
YES
|
YES
|
| Telecom IC Type |
ETHERNET TRANSCEIVER
|
ETHERNET TRANSCEIVER
|
| Temperature Grade |
COMMERCIAL
|
|
| Terminal Finish |
MATTE TIN
|
|
| Terminal Form |
NO LEAD
|
BALL
|
| Terminal Pitch |
0.4 mm
|
1 mm
|
| Terminal Position |
QUAD
|
BOTTOM
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
|
| Width |
8 mm
|
17 mm
|
| Base Number Matches |
3
|
1
|
| Package Description |
|
BGA,
|
|
|
|
Compare KSZ9031MNXCA with alternatives
Compare VSC8574XKS-05 with alternatives