KSZ9031MNXIA
vs
VSC8258YMR
feature comparison
Rohs Code |
Yes
|
|
Part Life Cycle Code |
Active
|
End Of Life
|
Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
MICROCHIP TECHNOLOGY INC
|
Package Description |
HVQCCN,
|
FCBGA-256
|
Reach Compliance Code |
compliant
|
compliant
|
ECCN Code |
EAR99
|
5A002.A.1
|
HTS Code |
8517.70.00.00
|
8542.39.00.01
|
Date Of Intro |
2016-02-19
|
|
Samacsys Manufacturer |
Microchip
|
|
Data Rate |
1000000 Mbps
|
|
JESD-30 Code |
S-XQCC-N64
|
S-PBGA-B256
|
JESD-609 Code |
e3
|
|
Length |
8 mm
|
17 mm
|
Number of Functions |
1
|
1
|
Number of Terminals |
64
|
256
|
Number of Transceivers |
1
|
|
Operating Temperature-Max |
85 °C
|
110 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Package Body Material |
UNSPECIFIED
|
PLASTIC/EPOXY
|
Package Code |
HVQCCN
|
BGA
|
Package Equivalence Code |
LCC64,.32SQ,16
|
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
GRID ARRAY
|
Peak Reflow Temperature (Cel) |
260
|
|
Seated Height-Max |
0.9 mm
|
2.7 mm
|
Supply Voltage-Nom |
1.2 V
|
1 V
|
Surface Mount |
YES
|
YES
|
Telecom IC Type |
ETHERNET TRANSCEIVER
|
ETHERNET TRANSCEIVER
|
Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
Terminal Finish |
MATTE TIN
|
|
Terminal Form |
NO LEAD
|
BALL
|
Terminal Pitch |
0.4 mm
|
1 mm
|
Terminal Position |
QUAD
|
BOTTOM
|
Time@Peak Reflow Temperature-Max (s) |
30
|
|
Width |
8 mm
|
17 mm
|
Base Number Matches |
1
|
1
|
|
|
|
Compare KSZ9031MNXIA with alternatives
Compare VSC8258YMR with alternatives