KSZ9563RNXC-TR
vs
KSZ8895RQXCA
feature comparison
Part Life Cycle Code |
Active
|
Active
|
Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
MICROCHIP TECHNOLOGY INC
|
Package Description |
HVQCCN,
|
FQFP,
|
Reach Compliance Code |
compliant
|
compliant
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Factory Lead Time |
7 Weeks
|
4 Weeks
|
Date Of Intro |
2018-02-16
|
|
Samacsys Manufacturer |
Microchip
|
Microchip
|
JESD-30 Code |
S-PQCC-N64
|
R-PQFP-G128
|
JESD-609 Code |
e3
|
e3
|
Length |
8 mm
|
20 mm
|
Moisture Sensitivity Level |
3
|
1
|
Number of Functions |
1
|
1
|
Number of Terminals |
64
|
128
|
Operating Temperature-Max |
70 °C
|
70 °C
|
Operating Temperature-Min |
|
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
HVQCCN
|
FQFP
|
Package Equivalence Code |
LCC64,.32SQ,16
|
QFP128,.68X.91,20
|
Package Shape |
SQUARE
|
RECTANGULAR
|
Package Style |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
FLATPACK, FINE PITCH
|
Peak Reflow Temperature (Cel) |
260
|
260
|
Seated Height-Max |
0.9 mm
|
3.4 mm
|
Supply Voltage-Nom |
1.2 V
|
1.2 V
|
Surface Mount |
YES
|
YES
|
Telecom IC Type |
ETHERNET SWITCH
|
ETHERNET SWITCH
|
Temperature Grade |
COMMERCIAL
|
COMMERCIAL
|
Terminal Finish |
MATTE TIN
|
MATTE TIN
|
Terminal Form |
NO LEAD
|
GULL WING
|
Terminal Pitch |
0.4 mm
|
0.5 mm
|
Terminal Position |
QUAD
|
QUAD
|
Time@Peak Reflow Temperature-Max (s) |
30
|
30
|
Width |
8 mm
|
14 mm
|
Base Number Matches |
1
|
2
|
Rohs Code |
|
Yes
|
Data Rate |
|
100000 Mbps
|
Number of Transceivers |
|
5
|
Technology |
|
CMOS
|
|
|
|
Compare KSZ9563RNXC-TR with alternatives
Compare KSZ8895RQXCA with alternatives