L5973AD
vs
MC33063AVPG
feature comparison
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Active
|
Active
|
Ihs Manufacturer |
STMICROELECTRONICS
|
ROCHESTER ELECTRONICS LLC
|
Part Package Code |
SOIC
|
DIP
|
Package Description |
EXPOSED PAD, HSOP-8
|
LEAD FREE, PLASTIC, DIP-8
|
Pin Count |
8
|
8
|
Reach Compliance Code |
compliant
|
unknown
|
ECCN Code |
EAR99
|
|
HTS Code |
8542.39.00.01
|
|
Factory Lead Time |
15 Weeks, 6 Days
|
|
Samacsys Manufacturer |
STMicroelectronics
|
|
Analog IC - Other Type |
SWITCHING REGULATOR
|
SWITCHING REGULATOR
|
Control Mode |
VOLTAGE-MODE
|
VOLTAGE-MODE
|
Control Technique |
PULSE WIDTH MODULATION
|
PULSE WIDTH MODULATION
|
Input Voltage-Max |
36 V
|
40 V
|
Input Voltage-Min |
4.4 V
|
3 V
|
Input Voltage-Nom |
12 V
|
5 V
|
JESD-30 Code |
R-PDSO-G8
|
R-PDIP-T8
|
JESD-609 Code |
e3
|
e3
|
Length |
4.9 mm
|
9.78 mm
|
Moisture Sensitivity Level |
3
|
NOT SPECIFIED
|
Number of Functions |
1
|
1
|
Number of Terminals |
8
|
8
|
Output Current-Max |
2.3 A
|
1.5 A
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
HSOP
|
DIP
|
Package Equivalence Code |
SOP8,.25
|
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
SMALL OUTLINE, HEAT SINK/SLUG
|
IN-LINE
|
Peak Reflow Temperature (Cel) |
260
|
260
|
Qualification Status |
Not Qualified
|
|
Seated Height-Max |
1.75 mm
|
4.45 mm
|
Surface Mount |
YES
|
NO
|
Switcher Configuration |
BUCK
|
BUCK-BOOST
|
Technology |
MOS
|
|
Terminal Finish |
Matte Tin (Sn)
|
MATTE TIN
|
Terminal Form |
GULL WING
|
THROUGH-HOLE
|
Terminal Pitch |
1.27 mm
|
2.54 mm
|
Terminal Position |
DUAL
|
DUAL
|
Time@Peak Reflow Temperature-Max (s) |
30
|
40
|
Width |
3.9 mm
|
7.62 mm
|
Base Number Matches |
1
|
2
|
Pbfree Code |
|
No
|
Operating Temperature-Max |
|
125 °C
|
Operating Temperature-Min |
|
-40 °C
|
Switching Frequency-Max |
|
100 kHz
|
Temperature Grade |
|
AUTOMOTIVE
|
|
|
|
Compare L5973AD with alternatives
Compare MC33063AVPG with alternatives