L6201013TR
vs
L6201
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
STMICROELECTRONICS
|
STMICROELECTRONICS
|
| Part Package Code |
SOIC
|
SOIC
|
| Package Description |
SOP-20
|
SOP-20
|
| Pin Count |
20
|
20
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Factory Lead Time |
17 Weeks, 3 Days
|
25 Weeks
|
| Samacsys Manufacturer |
STMicroelectronics
|
STMicroelectronics
|
| Built-in Protections |
TRANSIENT; THERMAL
|
TRANSIENT; THERMAL
|
| Input Characteristics |
STANDARD
|
STANDARD
|
| Interface IC Type |
FULL BRIDGE BASED PERIPHERAL DRIVER
|
FULL BRIDGE BASED PERIPHERAL DRIVER
|
| JESD-30 Code |
R-PDSO-G20
|
R-PDSO-G20
|
| Length |
12.8 mm
|
12.8 mm
|
| Moisture Sensitivity Level |
3
|
3
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
20
|
20
|
| Output Characteristics |
TOTEM-POLE
|
TOTEM-POLE
|
| Output Current Flow Direction |
SOURCE AND SINK
|
SOURCE AND SINK
|
| Output Peak Current Limit-Nom |
0.002 A
|
5 A
|
| Output Polarity |
TRUE
|
TRUE
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
SOP
|
SOP
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE
|
SMALL OUTLINE
|
| Peak Reflow Temperature (Cel) |
250
|
260
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
2.65 mm
|
2.65 mm
|
| Supply Voltage-Max |
48 V
|
48 V
|
| Supply Voltage-Min |
12 V
|
12 V
|
| Supply Voltage-Nom |
36 V
|
36 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
BCDMOS
|
BCDMOS
|
| Terminal Finish |
Tin (Sn) - immersion
|
Nickel/Palladium/Gold (Ni/Pd/Au)
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
1.27 mm
|
1.27 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Width |
7.5 mm
|
7.5 mm
|
| Base Number Matches |
1
|
8
|
| JESD-609 Code |
|
e4
|
| Time@Peak Reflow Temperature-Max (s) |
|
30
|
|
|
|