L6205PD
vs
L6208D
feature comparison
| Rohs Code |
Yes
|
No
|
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
STMICROELECTRONICS
|
STMICROELECTRONICS
|
| Part Package Code |
SOIC
|
SOIC
|
| Package Description |
POWER, MO-166, SO-20
|
SO-24
|
| Pin Count |
20
|
24
|
| Reach Compliance Code |
not_compliant
|
unknown
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Factory Lead Time |
16 Weeks, 3 Days
|
16 Weeks, 3 Days
|
| Samacsys Manufacturer |
STMicroelectronics
|
STMicroelectronics
|
| Analog IC - Other Type |
STEPPER MOTOR CONTROLLER
|
STEPPER MOTOR CONTROLLER
|
| JESD-30 Code |
R-PDSO-G20
|
R-PDSO-G24
|
| JESD-609 Code |
e3
|
e4
|
| Length |
15.9 mm
|
15.4 mm
|
| Moisture Sensitivity Level |
3
|
3
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
20
|
24
|
| Operating Temperature-Max |
150 °C
|
150 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Output Current-Max |
5.6 A
|
5.6 A
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
HSOP
|
SOP
|
| Package Equivalence Code |
SOP20,.56
|
SOP24,.4
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE, HEAT SINK/SLUG
|
SMALL OUTLINE
|
| Peak Reflow Temperature (Cel) |
245
|
250
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
3.6 mm
|
2.65 mm
|
| Supply Voltage-Max (Vsup) |
52 V
|
52 V
|
| Supply Voltage-Min (Vsup) |
8 V
|
8 V
|
| Supply Voltage-Nom (Vsup) |
48 V
|
48 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
BCDMOS
|
BCDMOS
|
| Temperature Grade |
AUTOMOTIVE
|
AUTOMOTIVE
|
| Terminal Finish |
Matte Tin (Sn) - annealed
|
Nickel/Palladium/Gold (Ni/Pd/Au)
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
1.27 mm
|
1.27 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
30
|
| Width |
11 mm
|
7.5 mm
|
| Base Number Matches |
2
|
3
|
| Supply Current-Max (Isup) |
|
10 mA
|
|
|
|
Compare L6205PD with alternatives
Compare L6208D with alternatives