L6370D013TR
vs
L6370Q
feature comparison
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Active
|
Obsolete
|
Ihs Manufacturer |
STMICROELECTRONICS
|
STMICROELECTRONICS
|
Part Package Code |
SOIC
|
|
Package Description |
ROHS COMPLIANT, MO-166, SOP-20
|
|
Pin Count |
20
|
|
Reach Compliance Code |
not_compliant
|
compliant
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Factory Lead Time |
16 Weeks
|
|
Samacsys Manufacturer |
STMicroelectronics
|
STMicroelectronics
|
Built-in Protections |
TRANSIENT; OVER CURRENT; THERMAL; UNDER VOLTAGE
|
|
Driver Number of Bits |
1
|
1
|
Interface IC Type |
BUFFER OR INVERTER BASED PERIPHERAL DRIVER
|
BUFFER OR INVERTER BASED PERIPHERAL DRIVER
|
JESD-30 Code |
R-PDSO-G20
|
S-PQCC-N48
|
JESD-609 Code |
e3
|
e3
|
Length |
15.9 mm
|
|
Number of Functions |
1
|
|
Number of Terminals |
20
|
48
|
Operating Temperature-Max |
85 °C
|
85 °C
|
Operating Temperature-Min |
-25 °C
|
-25 °C
|
Output Current Flow Direction |
SINK
|
|
Output Current-Max |
0.004 A
|
2.5 A
|
Output Peak Current Limit-Nom |
3.2 A
|
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
HSOP
|
QCCN
|
Package Equivalence Code |
SOP20,.56
|
LCC48,.27SQ,20
|
Package Shape |
RECTANGULAR
|
SQUARE
|
Package Style |
SMALL OUTLINE, HEAT SINK/SLUG
|
CHIP CARRIER
|
Peak Reflow Temperature (Cel) |
245
|
260
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
3.6 mm
|
|
Supply Voltage-Max |
35 V
|
|
Supply Voltage-Min |
9.5 V
|
|
Supply Voltage-Nom |
24 V
|
24 V
|
Surface Mount |
YES
|
YES
|
Technology |
BCD
|
BCDMOS
|
Temperature Grade |
OTHER
|
OTHER
|
Terminal Finish |
Matte Tin (Sn)
|
MATTE TIN
|
Terminal Form |
GULL WING
|
NO LEAD
|
Terminal Pitch |
1.27 mm
|
0.5 mm
|
Terminal Position |
DUAL
|
QUAD
|
Time@Peak Reflow Temperature-Max (s) |
30
|
40
|
Width |
11 mm
|
|
Base Number Matches |
1
|
2
|
Moisture Sensitivity Level |
|
3
|
|
|
|
Compare L6370D013TR with alternatives
Compare L6370Q with alternatives