L6470HTR
vs
L6470H
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
STMICROELECTRONICS
|
STMICROELECTRONICS
|
| Part Package Code |
SSOP
|
SSOP
|
| Package Description |
ROHS COMPLIANT, HTSSOP-28
|
ROHS COMPLIANT, HTSSOP-28
|
| Pin Count |
28
|
28
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Factory Lead Time |
17 Weeks
|
16 Weeks, 3 Days
|
| Samacsys Manufacturer |
STMicroelectronics
|
STMicroelectronics
|
| Analog IC - Other Type |
STEPPER MOTOR CONTROLLER
|
STEPPER MOTOR CONTROLLER
|
| JESD-30 Code |
R-PDSO-G28
|
R-PDSO-G28
|
| JESD-609 Code |
e3
|
e3
|
| Length |
9.7 mm
|
9.7 mm
|
| Moisture Sensitivity Level |
3
|
3
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
28
|
28
|
| Output Current-Max |
7 A
|
7 A
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
HTSSOP
|
HTSSOP
|
| Package Equivalence Code |
TSSOP28,.25
|
TSSOP28,.25
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH
|
SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH
|
| Peak Reflow Temperature (Cel) |
260
|
260
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
1.2 mm
|
1.2 mm
|
| Supply Current-Max (Isup) |
0.65 mA
|
0.65 mA
|
| Supply Voltage-Max (Vsup) |
45 V
|
45 V
|
| Supply Voltage-Min (Vsup) |
8 V
|
8 V
|
| Supply Voltage-Nom (Vsup) |
36 V
|
36 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
BIPOLAR
|
BIPOLAR
|
| Terminal Finish |
Matte Tin (Sn)
|
Matte Tin (Sn)
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
0.65 mm
|
0.65 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
30
|
| Width |
4.4 mm
|
4.4 mm
|
| Base Number Matches |
1
|
2
|
|
|
|