L9615D
vs
TJA1042TK/3,118
feature comparison
| Part Life Cycle Code |
Not Recommended
|
Not Recommended
|
| Ihs Manufacturer |
STMICROELECTRONICS
|
NXP SEMICONDUCTORS
|
| Part Package Code |
SOIC
|
SON
|
| Package Description |
SOP, SOP8,.25
|
3 X 3 MM, 0.85 MM HEIGHT, PLASTIC, MO-229, SOT782-1, HVSON-8
|
| Pin Count |
8
|
8
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Factory Lead Time |
18 Weeks
|
|
| Samacsys Manufacturer |
STMicroelectronics
|
NXP
|
| JESD-30 Code |
R-PDSO-G8
|
S-PDSO-N8
|
| JESD-609 Code |
e4
|
e3
|
| Length |
4.9 mm
|
3 mm
|
| Moisture Sensitivity Level |
3
|
1
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
8
|
8
|
| Number of Transceivers |
1
|
1
|
| Operating Temperature-Max |
110 °C
|
150 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
SOP
|
HVSON
|
| Package Equivalence Code |
SOP8,.25
|
SOLCC8,.12,25
|
| Package Shape |
RECTANGULAR
|
SQUARE
|
| Package Style |
SMALL OUTLINE
|
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
|
| Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
260
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
1.75 mm
|
1 mm
|
| Supply Voltage-Nom |
5 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
BICMOS
|
|
| Telecom IC Type |
INTERFACE CIRCUIT
|
CAN TRANSCEIVER
|
| Temperature Grade |
INDUSTRIAL
|
AUTOMOTIVE
|
| Terminal Finish |
Nickel/Palladium/Gold (Ni/Pd/Au)
|
Matte Tin (Sn)
|
| Terminal Form |
GULL WING
|
NO LEAD
|
| Terminal Pitch |
1.27 mm
|
0.65 mm
|
| Terminal Position |
DUAL
|
QUAD
|
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
NOT SPECIFIED
|
| Width |
3.9 mm
|
3 mm
|
| Base Number Matches |
1
|
1
|
| Rohs Code |
|
Yes
|
| Manufacturer Package Code |
|
SOT782-1
|
| Data Rate |
|
5000 Mbps
|
| Screening Level |
|
AEC-Q100
|
| Supply Current-Max |
|
70 mA
|
|
|
|
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