LA7832
vs
TEA8172
feature comparison
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
SANYO SEMICONDUCTOR CO LTD
|
TELEFUNKEN MICROELECTRONICS GMBH
|
| Package Description |
,
|
|
| Reach Compliance Code |
unknown
|
unknown
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Consumer IC Type |
VERTICAL DEFLECTION IC
|
VERTICAL DEFLECTION IC
|
| Base Number Matches |
2
|
3
|
| Rohs Code |
|
No
|
| Blanking Output |
|
NO
|
| JESD-30 Code |
|
R-PZIP-T7
|
| JESD-609 Code |
|
e0
|
| Number of Functions |
|
1
|
| Number of Terminals |
|
7
|
| Package Body Material |
|
PLASTIC/EPOXY
|
| Package Code |
|
ZIP
|
| Package Equivalence Code |
|
ZIP7,.2,.1TB
|
| Package Shape |
|
RECTANGULAR
|
| Package Style |
|
IN-LINE
|
| Qualification Status |
|
Not Qualified
|
| Surface Mount |
|
NO
|
| Technology |
|
BIPOLAR
|
| Terminal Finish |
|
Tin/Lead (Sn/Pb)
|
| Terminal Form |
|
THROUGH-HOLE
|
| Terminal Pitch |
|
1.27 mm
|
| Terminal Position |
|
ZIG-ZAG
|
|
|
|
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