LA7837
vs
TDA8354Q
feature comparison
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
SANYO SEMICONDUCTOR CO LTD
|
NXP SEMICONDUCTORS
|
| Package Description |
,
|
ZIP, ZIP13,.2,.17,67
|
| Reach Compliance Code |
unknown
|
unknown
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Consumer IC Type |
VERTICAL DEFLECTION IC
|
VERTICAL DEFLECTION IC
|
| Base Number Matches |
1
|
3
|
| Rohs Code |
|
No
|
| Part Package Code |
|
ZIP
|
| Pin Count |
|
13
|
| Blanking Output |
|
NO
|
| JESD-30 Code |
|
R-PZIP-T13
|
| Length |
|
23.8 mm
|
| Number of Functions |
|
1
|
| Number of Terminals |
|
13
|
| Operating Temperature-Max |
|
85 °C
|
| Operating Temperature-Min |
|
-25 °C
|
| Package Body Material |
|
PLASTIC/EPOXY
|
| Package Code |
|
ZIP
|
| Package Equivalence Code |
|
ZIP13,.2,.17,67
|
| Package Shape |
|
RECTANGULAR
|
| Package Style |
|
IN-LINE
|
| Qualification Status |
|
Not Qualified
|
| Seated Height-Max |
|
17 mm
|
| Supply Voltage-Max (Vsup) |
|
18 V
|
| Supply Voltage-Min (Vsup) |
|
7.5 V
|
| Surface Mount |
|
NO
|
| Technology |
|
BCDMOS
|
| Temperature Grade |
|
OTHER
|
| Terminal Form |
|
THROUGH-HOLE
|
| Terminal Pitch |
|
1.7 mm
|
| Terminal Position |
|
ZIG-ZAG
|
| Width |
|
4.5 mm
|
|
|
|
Compare LA7837 with alternatives
Compare TDA8354Q with alternatives