LAN9353/ML
vs
KSZ8895FQXC
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
MICROCHIP TECHNOLOGY INC
|
| Package Description |
HVQCCN,
|
FQFP,
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
5A991.B.1
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Factory Lead Time |
5 Weeks
|
4 Weeks
|
| Samacsys Manufacturer |
Microchip
|
Microchip
|
| JESD-30 Code |
S-XQCC-N64
|
R-PQFP-G128
|
| JESD-609 Code |
e3
|
e3
|
| Length |
9 mm
|
20 mm
|
| Moisture Sensitivity Level |
3
|
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
64
|
128
|
| Operating Temperature-Max |
70 °C
|
70 °C
|
| Operating Temperature-Min |
|
|
| Package Body Material |
UNSPECIFIED
|
PLASTIC/EPOXY
|
| Package Code |
HVQCCN
|
FQFP
|
| Package Equivalence Code |
LCC64,.35SQ,20
|
QFP128,.68X.91,20
|
| Package Shape |
SQUARE
|
RECTANGULAR
|
| Package Style |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
FLATPACK, FINE PITCH
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Screening Level |
TS 16949
|
TS 16949
|
| Seated Height-Max |
1 mm
|
3.4 mm
|
| Supply Voltage-Nom |
3.3 V
|
1.2 V
|
| Surface Mount |
YES
|
YES
|
| Telecom IC Type |
ETHERNET SWITCH
|
ETHERNET SWITCH
|
| Temperature Grade |
INDUSTRIAL
|
COMMERCIAL
|
| Terminal Finish |
MATTE TIN
|
MATTE TIN
|
| Terminal Form |
NO LEAD
|
GULL WING
|
| Terminal Pitch |
0.5 mm
|
0.5 mm
|
| Terminal Position |
QUAD
|
QUAD
|
| Time@Peak Reflow Temperature-Max (s) |
40
|
|
| Width |
9 mm
|
14 mm
|
| Base Number Matches |
1
|
4
|
| Date Of Intro |
|
2016-08-12
|
|
|
|
Compare LAN9353/ML with alternatives
Compare KSZ8895FQXC with alternatives