LAN9355I/PT
vs
BCM53124SIMML
feature comparison
| Rohs Code |
Yes
|
|
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
BROADCOM INC
|
| Package Description |
HTFQFP,
|
HVBCC,
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
|
| HTS Code |
8542.39.00.01
|
|
| Factory Lead Time |
7 Weeks
|
|
| Samacsys Manufacturer |
Microchip
|
|
| JESD-30 Code |
S-PQFP-G80
|
|
| JESD-609 Code |
e3
|
|
| Length |
12 mm
|
|
| Number of Functions |
1
|
|
| Number of Terminals |
80
|
|
| Operating Temperature-Max |
85 °C
|
|
| Operating Temperature-Min |
-40 °C
|
|
| Package Body Material |
PLASTIC/EPOXY
|
|
| Package Code |
HTFQFP
|
|
| Package Equivalence Code |
TQFP80,.55SQ
|
|
| Package Shape |
SQUARE
|
|
| Package Style |
FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH
|
|
| Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
|
| Screening Level |
TS 16949
|
|
| Seated Height-Max |
1.2 mm
|
|
| Supply Voltage-Nom |
1.2 V
|
|
| Surface Mount |
YES
|
|
| Telecom IC Type |
ETHERNET SWITCH
|
|
| Temperature Grade |
INDUSTRIAL
|
|
| Terminal Finish |
Matte Tin (Sn)
|
|
| Terminal Form |
GULL WING
|
|
| Terminal Pitch |
0.5 mm
|
|
| Terminal Position |
QUAD
|
|
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
|
| Width |
12 mm
|
|
| Base Number Matches |
1
|
1
|
|
|
|
Compare LAN9355I/PT with alternatives
Compare BCM53124SIMML with alternatives