LAN9355T/ML
vs
KSZ8563RNXV
feature comparison
Rohs Code |
Yes
|
|
Part Life Cycle Code |
Active
|
Active
|
Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
MICROCHIP TECHNOLOGY INC
|
Package Description |
HVQCCN,
|
HVQCCN,
|
Reach Compliance Code |
compliant
|
compliant
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Factory Lead Time |
7 Weeks
|
6 Weeks
|
Samacsys Manufacturer |
Microchip
|
Microchip
|
JESD-30 Code |
S-XQCC-N88
|
S-PQCC-N64
|
Length |
12 mm
|
8 mm
|
Number of Functions |
1
|
1
|
Number of Terminals |
88
|
64
|
Operating Temperature-Max |
70 °C
|
105 °C
|
Operating Temperature-Min |
|
-40 °C
|
Package Body Material |
UNSPECIFIED
|
PLASTIC/EPOXY
|
Package Code |
HVQCCN
|
HVQCCN
|
Package Equivalence Code |
LCC88,.5SQ,20
|
LCC64,.32SQ,16
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
|
Screening Level |
TS 16949
|
|
Seated Height-Max |
1 mm
|
0.9 mm
|
Supply Voltage-Nom |
1.2 V
|
1.2 V
|
Surface Mount |
YES
|
YES
|
Telecom IC Type |
ETHERNET SWITCH
|
ETHERNET SWITCH
|
Temperature Grade |
COMMERCIAL
|
INDUSTRIAL
|
Terminal Form |
NO LEAD
|
NO LEAD
|
Terminal Pitch |
0.5 mm
|
0.4 mm
|
Terminal Position |
QUAD
|
QUAD
|
Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
|
Width |
12 mm
|
8 mm
|
Base Number Matches |
1
|
1
|
JESD-609 Code |
|
e3
|
Terminal Finish |
|
Matte Tin (Sn) - annealed
|
|
|
|
Compare LAN9355T/ML with alternatives
Compare KSZ8563RNXV with alternatives