LC75
vs
PIC17LC756AT-08/L
feature comparison
Rohs Code |
No
|
Yes
|
Part Life Cycle Code |
Active
|
Active
|
Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
MICROCHIP TECHNOLOGY INC
|
Package Description |
HERMETIC SEALED, METAL GLASS, DO-13, 2 PIN
|
PLASTIC, MO-047, LCC-68
|
Reach Compliance Code |
compliant
|
compliant
|
Breakdown Voltage-Max |
102 V
|
|
Breakdown Voltage-Min |
83.3 V
|
|
Breakdown Voltage-Nom |
83 V
|
|
Case Connection |
CATHODE
|
|
Clamping Voltage-Max |
134 V
|
|
Configuration |
SINGLE
|
|
Diode Element Material |
SILICON
|
|
Diode Type |
TRANS VOLTAGE SUPPRESSOR DIODE
|
|
JEDEC-95 Code |
DO-202AA
|
|
JESD-30 Code |
O-MALF-W2
|
S-PQCC-J68
|
JESD-609 Code |
e0
|
e3
|
Non-rep Peak Rev Power Dis-Max |
1500 W
|
|
Number of Elements |
1
|
|
Number of Terminals |
2
|
68
|
Operating Temperature-Max |
175 °C
|
70 °C
|
Operating Temperature-Min |
-65 °C
|
|
Package Body Material |
METAL
|
PLASTIC/EPOXY
|
Package Shape |
ROUND
|
SQUARE
|
Package Style |
LONG FORM
|
CHIP CARRIER
|
Polarity |
UNIDIRECTIONAL
|
|
Power Dissipation-Max |
1 W
|
|
Rep Pk Reverse Voltage-Max |
75 V
|
|
Surface Mount |
NO
|
YES
|
Technology |
AVALANCHE
|
CMOS
|
Terminal Finish |
TIN LEAD
|
MATTE TIN
|
Terminal Form |
WIRE
|
J BEND
|
Terminal Position |
AXIAL
|
QUAD
|
Base Number Matches |
51
|
1
|
Pbfree Code |
|
Yes
|
Part Package Code |
|
LCC
|
Pin Count |
|
68
|
HTS Code |
|
8542.31.00.01
|
Has ADC |
|
YES
|
Address Bus Width |
|
16
|
Bit Size |
|
8
|
Clock Frequency-Max |
|
8 MHz
|
DAC Channels |
|
NO
|
DMA Channels |
|
NO
|
External Data Bus Width |
|
8
|
Length |
|
24.23 mm
|
Moisture Sensitivity Level |
|
3
|
Number of I/O Lines |
|
50
|
On Chip Program ROM Width |
|
16
|
PWM Channels |
|
YES
|
Package Code |
|
QCCJ
|
Peak Reflow Temperature (Cel) |
|
245
|
Qualification Status |
|
Not Qualified
|
RAM (bytes) |
|
902
|
ROM (words) |
|
16384
|
ROM Programmability |
|
OTPROM
|
Seated Height-Max |
|
4.57 mm
|
Speed |
|
8 MHz
|
Supply Voltage-Max |
|
5.5 V
|
Supply Voltage-Min |
|
3 V
|
Supply Voltage-Nom |
|
5 V
|
Temperature Grade |
|
COMMERCIAL
|
Terminal Pitch |
|
1.27 mm
|
Time@Peak Reflow Temperature-Max (s) |
|
40
|
Width |
|
24.23 mm
|
uPs/uCs/Peripheral ICs Type |
|
MICROCONTROLLER, RISC
|
|
|
|
Compare LC75 with alternatives
Compare PIC17LC756AT-08/L with alternatives