LE58QL021BVC
vs
TLV320AIC1103GQER
feature comparison
| Rohs Code |
Yes
|
No
|
| Part Life Cycle Code |
Transferred
|
Obsolete
|
| Ihs Manufacturer |
ZARLINK SEMICONDUCTOR INC
|
TEXAS INSTRUMENTS INC
|
| Package Description |
TQFP, TQFP44,.47SQ,32
|
PLASTIC, MICRO, BGA-80
|
| Reach Compliance Code |
unknown
|
not_compliant
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Additional Feature |
IT ALSO OPERATES WITH 3.3V ANALOG SUPPLY VOLTAGE
|
|
| Companding Law |
A/MU-LAW
|
A/MU-LAW
|
| Filter |
YES
|
YES
|
| Gain Tolerance-Max |
0.4 dB
|
1 dB
|
| JESD-30 Code |
S-PQFP-G44
|
S-PBGA-B80
|
| JESD-609 Code |
e3
|
|
| Length |
10 mm
|
5 mm
|
| Linear Coding |
16-BIT
|
15-BIT
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
44
|
80
|
| Operating Mode |
SYNCHRONOUS
|
SYNCHRONOUS
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
TQFP
|
VFBGA
|
| Package Equivalence Code |
TQFP44,.47SQ,32
|
BGA80,9X9,20
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
FLATPACK, THIN PROFILE
|
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
1.2 mm
|
1 mm
|
| Supply Voltage-Nom |
3.3 V
|
3 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Telecom IC Type |
PCM CODEC
|
PCM CODEC
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Finish |
Matte Tin (Sn)
|
|
| Terminal Form |
GULL WING
|
BALL
|
| Terminal Pitch |
0.8 mm
|
0.5 mm
|
| Terminal Position |
QUAD
|
BOTTOM
|
| Width |
10 mm
|
5 mm
|
| Base Number Matches |
4
|
1
|
| Pbfree Code |
|
No
|
| Part Package Code |
|
BGA
|
| Pin Count |
|
80
|
| Peak Reflow Temperature (Cel) |
|
NOT SPECIFIED
|
| Supply Current-Max |
|
0.007 mA
|
| Time@Peak Reflow Temperature-Max (s) |
|
NOT SPECIFIED
|
|
|
|
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