LF147J/883
vs
UPC452C
feature comparison
Rohs Code |
No
|
|
Part Life Cycle Code |
Transferred
|
|
Ihs Manufacturer |
NATIONAL SEMICONDUCTOR CORP
|
|
Part Package Code |
DIP
|
|
Package Description |
CERAMIC, DIP-14
|
|
Pin Count |
14
|
|
Reach Compliance Code |
not_compliant
|
|
ECCN Code |
EAR99
|
|
HTS Code |
8542.33.00.01
|
|
Amplifier Type |
OPERATIONAL AMPLIFIER
|
|
Architecture |
VOLTAGE-FEEDBACK
|
|
Average Bias Current-Max (IIB) |
0.0002 µA
|
|
Bias Current-Max (IIB) @25C |
0.0002 µA
|
|
Common-mode Reject Ratio-Min |
80 dB
|
|
Common-mode Reject Ratio-Nom |
80 dB
|
|
Frequency Compensation |
YES
|
|
Input Offset Current-Max (IIO) |
0.025 µA
|
|
Input Offset Voltage-Max |
5000 µV
|
|
JESD-30 Code |
R-GDIP-T14
|
|
JESD-609 Code |
e0
|
|
Length |
19.304 mm
|
|
Low-Bias |
YES
|
|
Low-Offset |
NO
|
|
Moisture Sensitivity Level |
1
|
|
Neg Supply Voltage Limit-Max |
-22 V
|
|
Neg Supply Voltage-Nom (Vsup) |
-20 V
|
|
Number of Functions |
4
|
|
Number of Terminals |
14
|
|
Operating Temperature-Max |
125 °C
|
|
Operating Temperature-Min |
-55 °C
|
|
Package Body Material |
CERAMIC, GLASS-SEALED
|
|
Package Code |
DIP
|
|
Package Equivalence Code |
DIP14,.3
|
|
Package Shape |
RECTANGULAR
|
|
Package Style |
IN-LINE
|
|
Packing Method |
RAIL
|
|
Peak Reflow Temperature (Cel) |
260
|
|
Qualification Status |
Not Qualified
|
|
Screening Level |
MIL-STD-883
|
|
Seated Height-Max |
5.08 mm
|
|
Slew Rate-Min |
8 V/us
|
|
Slew Rate-Nom |
13 V/us
|
|
Supply Current-Max |
11 mA
|
|
Supply Voltage Limit-Max |
22 V
|
|
Supply Voltage-Nom (Vsup) |
20 V
|
|
Surface Mount |
NO
|
|
Technology |
BIFET
|
|
Temperature Grade |
MILITARY
|
|
Terminal Finish |
TIN LEAD
|
|
Terminal Form |
THROUGH-HOLE
|
|
Terminal Pitch |
2.54 mm
|
|
Terminal Position |
DUAL
|
|
Time@Peak Reflow Temperature-Max (s) |
40
|
|
Unity Gain BW-Nom |
4000
|
|
Voltage Gain-Min |
25000
|
|
Width |
7.62 mm
|
|
Base Number Matches |
2
|
|
|
|
|
Compare LF147J/883 with alternatives