LF355CN vs LD355AB feature comparison

LF355CN STMicroelectronics

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LD355AB AMD

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer STMICROELECTRONICS ADVANCED MICRO DEVICES INC
Part Package Code DIP DIE
Package Description DIP, DIE,
Pin Count 8 7
Reach Compliance Code unknown unknown
ECCN Code EAR99 EAR99
HTS Code 8542.33.00.01 8542.33.00.01
Amplifier Type OPERATIONAL AMPLIFIER OPERATIONAL AMPLIFIER
Average Bias Current-Max (IIB) 0.008 µA 0.00005 µA
Common-mode Reject Ratio-Nom 100 dB 100 dB
Input Offset Voltage-Max 13000 µV 2300 µV
JESD-30 Code R-PDIP-T8 R-XUUC-N7
Neg Supply Voltage Limit-Max -22 V
Neg Supply Voltage-Nom (Vsup) -15 V -20 V
Number of Functions 1 1
Number of Terminals 8 7
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Package Body Material PLASTIC/EPOXY UNSPECIFIED
Package Code DIP DIE
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE UNCASED CHIP
Qualification Status Not Qualified Not Qualified
Slew Rate-Nom 5 V/us 5 V/us
Supply Voltage Limit-Max 22 V
Supply Voltage-Nom (Vsup) 15 V 20 V
Surface Mount NO YES
Technology BIPOLAR BIPOLAR
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Form THROUGH-HOLE NO LEAD
Terminal Position DUAL UPPER
Unity Gain BW-Nom 2500 2500
Base Number Matches 1 1
Supply Current-Max 4 mA

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