LF355N8
vs
LD355AB
feature comparison
| Part Life Cycle Code |
Active
|
Obsolete
|
| Ihs Manufacturer |
ANALOG DEVICES INC
|
ADVANCED MICRO DEVICES INC
|
| Package Description |
PACKAGE-8
|
DIE,
|
| Reach Compliance Code |
compliant
|
unknown
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.33.00.01
|
8542.33.00.01
|
| Amplifier Type |
OPERATIONAL AMPLIFIER
|
OPERATIONAL AMPLIFIER
|
| Architecture |
VOLTAGE-FEEDBACK
|
|
| Average Bias Current-Max (IIB) |
0.0002 µA
|
0.00005 µA
|
| Bias Current-Max (IIB) @25C |
0.0002 µA
|
|
| Common-mode Reject Ratio-Min |
80 dB
|
|
| Common-mode Reject Ratio-Nom |
100 dB
|
100 dB
|
| Frequency Compensation |
NO
|
|
| Input Offset Current-Max (IIO) |
0.00005 µA
|
|
| Input Offset Voltage-Max |
9000 µV
|
2300 µV
|
| JESD-30 Code |
R-PDIP-T8
|
R-XUUC-N7
|
| Length |
9.78 mm
|
|
| Low-Bias |
YES
|
|
| Low-Offset |
NO
|
|
| Micropower |
NO
|
|
| Neg Supply Voltage Limit-Max |
-18 V
|
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
8
|
7
|
| Operating Temperature-Max |
70 °C
|
70 °C
|
| Operating Temperature-Min |
|
|
| Package Body Material |
PLASTIC/EPOXY
|
UNSPECIFIED
|
| Package Code |
DIP
|
DIE
|
| Package Equivalence Code |
DIP8,.3
|
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
IN-LINE
|
UNCASED CHIP
|
| Programmable Power |
NO
|
|
| Seated Height-Max |
4.445 mm
|
|
| Slew Rate-Min |
2.5 V/us
|
|
| Slew Rate-Nom |
6 V/us
|
5 V/us
|
| Supply Current-Max |
4 mA
|
4 mA
|
| Supply Voltage Limit-Max |
18 V
|
|
| Surface Mount |
NO
|
YES
|
| Temperature Grade |
COMMERCIAL
|
COMMERCIAL
|
| Terminal Form |
THROUGH-HOLE
|
NO LEAD
|
| Terminal Pitch |
2.54 mm
|
|
| Terminal Position |
DUAL
|
UPPER
|
| Unity Gain BW-Nom |
2500
|
2500
|
| Voltage Gain-Min |
25000
|
|
| Width |
7.62 mm
|
|
| Base Number Matches |
2
|
1
|
| Part Package Code |
|
DIE
|
| Pin Count |
|
7
|
| Neg Supply Voltage-Nom (Vsup) |
|
-20 V
|
| Qualification Status |
|
Not Qualified
|
| Supply Voltage-Nom (Vsup) |
|
20 V
|
| Technology |
|
BIPOLAR
|
|
|
|
Compare LD355AB with alternatives