LFE2-6SE-5T144I
vs
LFE2-6E-6TN144C
feature comparison
Pbfree Code |
No
|
Yes
|
Rohs Code |
No
|
Yes
|
Part Life Cycle Code |
Obsolete
|
Active
|
Ihs Manufacturer |
LATTICE SEMICONDUCTOR CORP
|
LATTICE SEMICONDUCTOR CORP
|
Part Package Code |
QFP
|
QFP
|
Package Description |
TQFP-144
|
TQFP-144
|
Pin Count |
144
|
144
|
Reach Compliance Code |
not_compliant
|
compliant
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Clock Frequency-Max |
311 MHz
|
357 MHz
|
Combinatorial Delay of a CLB-Max |
0.358 ns
|
0.331 ns
|
JESD-30 Code |
S-PQFP-G144
|
S-PQFP-G144
|
JESD-609 Code |
e0
|
e3
|
Length |
20 mm
|
20 mm
|
Moisture Sensitivity Level |
3
|
3
|
Number of Inputs |
90
|
90
|
Number of Logic Cells |
6000
|
6000
|
Number of Outputs |
90
|
90
|
Number of Terminals |
144
|
144
|
Operating Temperature-Max |
85 °C
|
85 °C
|
Operating Temperature-Min |
-40 °C
|
|
Organization |
750 CLBS
|
750 CLBS
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
LFQFP
|
LFQFP
|
Package Equivalence Code |
QFP144,.87SQ,20
|
QFP144,.87SQ,20
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
FLATPACK, LOW PROFILE, FINE PITCH
|
FLATPACK, LOW PROFILE, FINE PITCH
|
Peak Reflow Temperature (Cel) |
225
|
260
|
Programmable Logic Type |
FIELD PROGRAMMABLE GATE ARRAY
|
FIELD PROGRAMMABLE GATE ARRAY
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
1.6 mm
|
1.6 mm
|
Supply Voltage-Max |
1.26 V
|
1.26 V
|
Supply Voltage-Min |
1.14 V
|
1.14 V
|
Supply Voltage-Nom |
1.2 V
|
1.2 V
|
Surface Mount |
YES
|
YES
|
Temperature Grade |
INDUSTRIAL
|
OTHER
|
Terminal Finish |
TIN LEAD
|
MATTE TIN
|
Terminal Form |
GULL WING
|
GULL WING
|
Terminal Pitch |
0.5 mm
|
0.5 mm
|
Terminal Position |
QUAD
|
QUAD
|
Width |
20 mm
|
20 mm
|
Base Number Matches |
1
|
1
|
Samacsys Manufacturer |
|
Lattice Semiconductor
|
Number of CLBs |
|
750
|
Time@Peak Reflow Temperature-Max (s) |
|
40
|
|
|
|
Compare LFE2-6SE-5T144I with alternatives
Compare LFE2-6E-6TN144C with alternatives