LFE2M50SE-6F900I vs ORSPI4-1FN1156C feature comparison

LFE2M50SE-6F900I Lattice Semiconductor Corporation

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ORSPI4-1FN1156C Lattice Semiconductor Corporation

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Pbfree Code No
Rohs Code No Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer LATTICE SEMICONDUCTOR CORP LATTICE SEMICONDUCTOR CORP
Part Package Code BGA BGA
Package Description FPBGA-900 35 X 35 MM, LEAD FREE, FPBGA-1156
Pin Count 900 1156
Reach Compliance Code compliant not_compliant
ECCN Code 3A991.D
HTS Code 8542.39.00.01 8542.39.00.01
Clock Frequency-Max 357 MHz 185 MHz
Combinatorial Delay of a CLB-Max 0.331 ns
JESD-30 Code S-PBGA-B900 S-PBGA-B1156
JESD-609 Code e0 e1
Length 31 mm 35 mm
Moisture Sensitivity Level 3 3
Number of Inputs 410
Number of Logic Cells 50000
Number of Outputs 410
Number of Terminals 900 1156
Operating Temperature-Max 85 °C 125 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Equivalence Code BGA900,30X30,40
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Peak Reflow Temperature (Cel) 225 250
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.6 mm 2.6 mm
Supply Voltage-Max 1.26 V 3.6 V
Supply Voltage-Min 1.14 V 3 V
Supply Voltage-Nom 1.2 V 3.3 V
Surface Mount YES YES
Temperature Grade INDUSTRIAL AUTOMOTIVE
Terminal Finish TIN LEAD TIN SILVER COPPER
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 30 40
Width 31 mm 35 mm
Base Number Matches 1 1
Number of CLBs 2024
Number of Equivalent Gates 471000
Organization 2024 CLBS, 471000 GATES

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