LFE2M50SE-6FN900C
vs
ORSPI4-3F1156C
feature comparison
| Pbfree Code |
Yes
|
|
| Rohs Code |
Yes
|
|
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
LATTICE SEMICONDUCTOR CORP
|
ROCHESTER ELECTRONICS INC
|
| Part Package Code |
BGA
|
BGA
|
| Package Description |
FPBGA-900
|
BGA,
|
| Pin Count |
900
|
1156
|
| Reach Compliance Code |
compliant
|
unknown
|
| ECCN Code |
3A991.D
|
|
| HTS Code |
8542.39.00.01
|
|
| Clock Frequency-Max |
357 MHz
|
185 MHz
|
| Combinatorial Delay of a CLB-Max |
0.331 ns
|
|
| JESD-30 Code |
S-PBGA-B900
|
S-PBGA-B1156
|
| JESD-609 Code |
e1
|
|
| Length |
31 mm
|
35 mm
|
| Moisture Sensitivity Level |
3
|
|
| Number of CLBs |
6000
|
2024
|
| Number of Inputs |
410
|
|
| Number of Logic Cells |
50000
|
|
| Number of Outputs |
410
|
|
| Number of Terminals |
900
|
1156
|
| Operating Temperature-Max |
85 °C
|
125 °C
|
| Operating Temperature-Min |
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
BGA
|
BGA
|
| Package Equivalence Code |
BGA900,30X30,40
|
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
GRID ARRAY
|
GRID ARRAY
|
| Peak Reflow Temperature (Cel) |
250
|
|
| Programmable Logic Type |
FIELD PROGRAMMABLE GATE ARRAY
|
FIELD PROGRAMMABLE GATE ARRAY
|
| Qualification Status |
Not Qualified
|
COMMERCIAL
|
| Seated Height-Max |
2.6 mm
|
2.6 mm
|
| Supply Voltage-Max |
1.26 V
|
3.6 V
|
| Supply Voltage-Min |
1.14 V
|
3 V
|
| Supply Voltage-Nom |
1.2 V
|
3.3 V
|
| Surface Mount |
YES
|
YES
|
| Temperature Grade |
OTHER
|
AUTOMOTIVE
|
| Terminal Finish |
TIN SILVER COPPER
|
|
| Terminal Form |
BALL
|
BALL
|
| Terminal Pitch |
1 mm
|
1 mm
|
| Terminal Position |
BOTTOM
|
BOTTOM
|
| Time@Peak Reflow Temperature-Max (s) |
40
|
|
| Width |
31 mm
|
35 mm
|
| Base Number Matches |
1
|
2
|
| Number of Equivalent Gates |
|
471000
|
| Organization |
|
2024 CLBS, 471000 GATES
|
|
|
|
Compare LFE2M50SE-6FN900C with alternatives