LFEC6E-3Q208I
vs
LFECP6E-3Q208I
feature comparison
Pbfree Code |
No
|
No
|
Rohs Code |
No
|
No
|
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
LATTICE SEMICONDUCTOR CORP
|
LATTICE SEMICONDUCTOR CORP
|
Part Package Code |
QFP
|
QFP
|
Package Description |
28 X 28 MM, PLASTIC, QFP-208
|
28 X 28 MM, PLASTIC, QFP-208
|
Pin Count |
208
|
208
|
Reach Compliance Code |
unknown
|
unknown
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Samacsys Manufacturer |
Lattice Semiconductor
|
|
Clock Frequency-Max |
420 MHz
|
420 MHz
|
Combinatorial Delay of a CLB-Max |
0.56 ns
|
0.56 ns
|
JESD-30 Code |
S-PQFP-G208
|
S-PQFP-G208
|
JESD-609 Code |
e0
|
e0
|
Length |
28 mm
|
28 mm
|
Moisture Sensitivity Level |
3
|
3
|
Number of CLBs |
768
|
768
|
Number of Inputs |
147
|
147
|
Number of Logic Cells |
6100
|
6100
|
Number of Outputs |
147
|
147
|
Number of Terminals |
208
|
208
|
Operating Temperature-Max |
85 °C
|
85 °C
|
Operating Temperature-Min |
|
|
Organization |
768 CLBS
|
768 CLBS
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
FQFP
|
FQFP
|
Package Equivalence Code |
QFP208,1.2SQ,20
|
QFP208,1.2SQ,20
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
FLATPACK, FINE PITCH
|
FLATPACK, FINE PITCH
|
Peak Reflow Temperature (Cel) |
225
|
225
|
Programmable Logic Type |
FIELD PROGRAMMABLE GATE ARRAY
|
FIELD PROGRAMMABLE GATE ARRAY
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
4.1 mm
|
4.1 mm
|
Supply Voltage-Max |
1.26 V
|
1.26 V
|
Supply Voltage-Min |
1.14 V
|
1.14 V
|
Supply Voltage-Nom |
1.2 V
|
1.2 V
|
Surface Mount |
YES
|
YES
|
Temperature Grade |
OTHER
|
OTHER
|
Terminal Finish |
Tin/Lead (Sn85Pb15)
|
Tin/Lead (Sn85Pb15)
|
Terminal Form |
GULL WING
|
GULL WING
|
Terminal Pitch |
0.5 mm
|
0.5 mm
|
Terminal Position |
QUAD
|
QUAD
|
Time@Peak Reflow Temperature-Max (s) |
30
|
30
|
Width |
28 mm
|
28 mm
|
Base Number Matches |
1
|
1
|
|
|
|
Compare LFEC6E-3Q208I with alternatives
Compare LFECP6E-3Q208I with alternatives