LFXP2-17E-5FTN256I vs LAXP2-17E-5FTN256E feature comparison

LFXP2-17E-5FTN256I Lattice Semiconductor Corporation

Buy Now Datasheet

LAXP2-17E-5FTN256E Lattice Semiconductor Corporation

Buy Now Datasheet
Pbfree Code Yes Yes
Rohs Code Yes Yes
Part Life Cycle Code Active Active
Ihs Manufacturer LATTICE SEMICONDUCTOR CORP LATTICE SEMICONDUCTOR CORP
Part Package Code BGA BGA
Pin Count 256 256
Reach Compliance Code compliant compliant
ECCN Code 3A991.D 3A991.D
HTS Code 8542.39.00.01 8542.39.00.01
Samacsys Manufacturer Lattice Semiconductor Lattice Semiconductor
Clock Frequency-Max 435 MHz 435 MHz
Combinatorial Delay of a CLB-Max 0.494 ns
JESD-30 Code S-PBGA-B256 S-PBGA-B256
JESD-609 Code e1 e1
Length 17 mm 17 mm
Moisture Sensitivity Level 3 3
Number of CLBs 2125
Number of Inputs 201 201
Number of Logic Cells 17000 17000
Number of Outputs 201 201
Number of Terminals 256 256
Operating Temperature-Max 100 °C 125 °C
Operating Temperature-Min -40 °C -40 °C
Organization 2125 CLBS 17000 GATES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA LBGA
Package Equivalence Code BGA256,16X16,40 BGA256,16X16,40
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY, LOW PROFILE
Peak Reflow Temperature (Cel) 260 260
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.1 mm 1.55 mm
Supply Voltage-Max 1.26 V 1.26 V
Supply Voltage-Min 1.14 V 1.14 V
Supply Voltage-Nom 1.2 V 1.2 V
Surface Mount YES YES
Technology CMOS
Terminal Finish TIN SILVER COPPER Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Width 17 mm 17 mm
Base Number Matches 2 1
Number of Equivalent Gates 17000
Screening Level AEC-Q100
Time@Peak Reflow Temperature-Max (s) 40

Compare LFXP2-17E-5FTN256I with alternatives

Compare LAXP2-17E-5FTN256E with alternatives