LFXP2-17E-5FTN256I
vs
LFXP2-17E-7FTN256C
feature comparison
| Pbfree Code |
Yes
|
Yes
|
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
LATTICE SEMICONDUCTOR CORP
|
LATTICE SEMICONDUCTOR CORP
|
| Part Package Code |
BGA
|
BGA
|
| Pin Count |
256
|
256
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
3A991.D
|
3A991.D
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Samacsys Manufacturer |
Lattice Semiconductor
|
Lattice Semiconductor
|
| Clock Frequency-Max |
435 MHz
|
435 MHz
|
| Combinatorial Delay of a CLB-Max |
0.494 ns
|
0.304 ns
|
| JESD-30 Code |
S-PBGA-B256
|
S-PBGA-B256
|
| JESD-609 Code |
e1
|
e1
|
| Length |
17 mm
|
17 mm
|
| Moisture Sensitivity Level |
3
|
3
|
| Number of CLBs |
2125
|
2125
|
| Number of Inputs |
201
|
201
|
| Number of Logic Cells |
17000
|
17000
|
| Number of Outputs |
201
|
201
|
| Number of Terminals |
256
|
256
|
| Operating Temperature-Max |
100 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
|
| Organization |
2125 CLBS
|
2125 CLBS
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
BGA
|
BGA
|
| Package Equivalence Code |
BGA256,16X16,40
|
BGA256,16X16,40
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
GRID ARRAY
|
GRID ARRAY
|
| Peak Reflow Temperature (Cel) |
260
|
260
|
| Programmable Logic Type |
FIELD PROGRAMMABLE GATE ARRAY
|
FIELD PROGRAMMABLE GATE ARRAY
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
2.1 mm
|
2.1 mm
|
| Supply Voltage-Max |
1.26 V
|
1.26 V
|
| Supply Voltage-Min |
1.14 V
|
1.14 V
|
| Supply Voltage-Nom |
1.2 V
|
1.2 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Terminal Finish |
TIN SILVER COPPER
|
TIN SILVER COPPER
|
| Terminal Form |
BALL
|
BALL
|
| Terminal Pitch |
1 mm
|
1 mm
|
| Terminal Position |
BOTTOM
|
BOTTOM
|
| Width |
17 mm
|
17 mm
|
| Base Number Matches |
2
|
2
|
| Temperature Grade |
|
OTHER
|
|
|
|
Compare LFXP2-17E-5FTN256I with alternatives
Compare LFXP2-17E-7FTN256C with alternatives