LFXP2-8E-7MN132C
vs
LFXP2-8E-5M132C
feature comparison
All Stats
Differences Only
Rohs Code
Yes
No
Part Life Cycle Code
Active
Obsolete
Ihs Manufacturer
LATTICE SEMICONDUCTOR CORP
LATTICE SEMICONDUCTOR CORP
Part Package Code
BGA
BGA
Pin Count
132
132
Reach Compliance Code
compliant
compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.39.00.01
8542.39.00.01
Clock Frequency-Max
435 MHz
435 MHz
Combinatorial Delay of a CLB-Max
0.304 ns
0.494 ns
JESD-30 Code
S-PBGA-B132
S-PBGA-B132
JESD-609 Code
e1
e0
Length
8 mm
8 mm
Moisture Sensitivity Level
3
3
Number of CLBs
1000
Number of Inputs
86
86
Number of Logic Cells
8000
8000
Number of Outputs
86
86
Number of Terminals
132
132
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
Organization
1000 CLBS
1000 CLBS
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
LFBGA
LFBGA
Package Equivalence Code
BGA132,14X14,20
BGA132,14X14,20
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY, LOW PROFILE, FINE PITCH
GRID ARRAY, LOW PROFILE, FINE PITCH
Peak Reflow Temperature (Cel)
260
240
Programmable Logic Type
FIELD PROGRAMMABLE GATE ARRAY
FIELD PROGRAMMABLE GATE ARRAY
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.35 mm
1.35 mm
Supply Voltage-Max
1.26 V
1.26 V
Supply Voltage-Min
1.14 V
1.14 V
Supply Voltage-Nom
1.2 V
1.2 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
OTHER
OTHER
Terminal Finish
TIN SILVER COPPER
TIN LEAD
Terminal Form
BALL
BALL
Terminal Pitch
0.5 mm
0.5 mm
Terminal Position
BOTTOM
BOTTOM
Time@Peak Reflow Temperature-Max (s)
40
30
Width
8 mm
8 mm
Base Number Matches
1
1
Package Description
8 X 8 MM, CSBGA-132
Samacsys Manufacturer
Lattice Semiconductor
Compare LFXP2-8E-7MN132C with alternatives
Compare LFXP2-8E-5M132C with alternatives