LH4002E-MIL
vs
HFA1113ML/883
feature comparison
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
NATIONAL SEMICONDUCTOR CORP
|
INTERSIL CORP
|
| Package Description |
QCCN, LCC20,.35SQ
|
CERAMIC, LCC-20
|
| Reach Compliance Code |
unknown
|
not_compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.33.00.01
|
8542.33.00.01
|
| Amplifier Type |
BUFFER
|
BUFFER
|
| Bandwidth (3dB)-Nom |
200 MHz
|
850 MHz
|
| Bias Current-Max (IIB) @25C |
200 µA
|
35 µA
|
| Input Offset Voltage-Max |
50000 µV
|
25000 µV
|
| JESD-30 Code |
S-XQCC-N20
|
S-CQCC-N20
|
| JESD-609 Code |
e0
|
e0
|
| Neg Supply Voltage Limit-Max |
-6 V
|
-6 V
|
| Neg Supply Voltage-Nom (Vsup) |
-5 V
|
-5 V
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
20
|
20
|
| Operating Temperature-Max |
125 °C
|
125 °C
|
| Operating Temperature-Min |
-55 °C
|
-55 °C
|
| Package Body Material |
CERAMIC
|
CERAMIC, METAL-SEALED COFIRED
|
| Package Code |
QCCN
|
QCCN
|
| Package Equivalence Code |
LCC20,.35SQ
|
LCC20,.35SQ
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
CHIP CARRIER
|
CHIP CARRIER
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Screening Level |
MIL-STD-883 Class B (Modified)
|
MIL-STD-883 Class B
|
| Slew Rate-Min |
1000 V/us
|
|
| Slew Rate-Nom |
1250 V/us
|
2400 V/us
|
| Supply Current-Max |
35 mA
|
33 mA
|
| Supply Voltage Limit-Max |
6 V
|
6 V
|
| Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
HYBRID
|
BIPOLAR
|
| Temperature Grade |
MILITARY
|
MILITARY
|
| Terminal Finish |
Tin/Lead (Sn/Pb)
|
TIN LEAD
|
| Terminal Form |
NO LEAD
|
NO LEAD
|
| Terminal Pitch |
1.27 mm
|
1.27 mm
|
| Terminal Position |
QUAD
|
QUAD
|
| Base Number Matches |
1
|
1
|
| Part Package Code |
|
QLCC
|
| Pin Count |
|
20
|
| Length |
|
8.89 mm
|
| Output Current-Min |
|
0.05 A
|
| Seated Height-Max |
|
2.54 mm
|
| Width |
|
8.89 mm
|
|
|
|
Compare LH4002E-MIL with alternatives
Compare HFA1113ML/883 with alternatives