LK21251R0K
vs
L0805C1R0KSMST
feature comparison
| Pbfree Code |
Yes
|
|
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
TAIYO YUDEN CO LTD
|
KEMET ELECTRONICS CORP
|
| Package Description |
0805
|
0805
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8504.50.80.00
|
8504.50.80.00
|
| Case/Size Code |
0805
|
0805
|
| Construction |
Multilayer Chip
|
Multilayer Chip
|
| Core Material |
FERRITE
|
Ferrite
|
| DC Resistance |
0.4 Ω
|
0.4 Ω
|
| Inductance-Nom (L) |
1 µH
|
1 µH
|
| Inductor Application |
RF INDUCTOR
|
RF INDUCTOR
|
| Inductor Type |
GENERAL PURPOSE INDUCTOR
|
GENERAL PURPOSE INDUCTOR
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
2
|
2
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Height |
0.85 mm
|
0.85 mm
|
| Package Length |
2 mm
|
2 mm
|
| Package Style |
SMT
|
SMT
|
| Package Width |
1.25 mm
|
1.25 mm
|
| Quality Factor-Min (at L-nom) |
45
|
45
|
| Rated Current-Max |
0.05 A
|
0.05 A
|
| Self Resonance Frequency |
75 MHz
|
75 MHz
|
| Shape/Size Description |
RECTANGULAR PACKAGE
|
RECTANGULAR PACKAGE
|
| Shielded |
YES
|
YES
|
| Surface Mount |
YES
|
YES
|
| Terminal Placement |
DUAL ENDED
|
DUAL ENDED
|
| Terminal Shape |
WRAPAROUND
|
WRAPAROUND
|
| Test Frequency |
10 MHz
|
10 MHz
|
| Tolerance |
10%
|
10%
|
| Base Number Matches |
1
|
1
|
| JESD-609 Code |
|
e3
|
| Packing Method |
|
TR
|
| Terminal Finish |
|
Matte Tin (Sn)
|
|
|
|
Compare LK21251R0K with alternatives
Compare L0805C1R0KSMST with alternatives