LM108AD
vs
TL062CDG4
feature comparison
| Rohs Code |
No
|
Yes
|
| Part Life Cycle Code |
Obsolete
|
Active
|
| Ihs Manufacturer |
MOTOROLA INC
|
ROCHESTER ELECTRONICS LLC
|
| Package Description |
DIP-8
|
GREEN, PLASTIC, MS-012AA, SOIC-8
|
| Reach Compliance Code |
unknown
|
unknown
|
| ECCN Code |
EAR99
|
|
| HTS Code |
8542.33.00.01
|
|
| Amplifier Type |
OPERATIONAL AMPLIFIER
|
OPERATIONAL AMPLIFIER
|
| Architecture |
VOLTAGE-FEEDBACK
|
|
| Frequency Compensation |
NO
|
|
| Input Offset Voltage-Max |
1000 µV
|
20000 µV
|
| JESD-30 Code |
R-XDIP-T8
|
R-PDSO-G8
|
| JESD-609 Code |
e0
|
e4
|
| Low-Offset |
NO
|
|
| Number of Functions |
1
|
2
|
| Number of Terminals |
8
|
8
|
| Operating Temperature-Max |
125 °C
|
70 °C
|
| Operating Temperature-Min |
-55 °C
|
|
| Package Body Material |
CERAMIC
|
PLASTIC/EPOXY
|
| Package Code |
DIP
|
SOP
|
| Package Equivalence Code |
DIP8,.3
|
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
IN-LINE
|
SMALL OUTLINE
|
| Qualification Status |
Not Qualified
|
|
| Surface Mount |
NO
|
YES
|
| Technology |
BIPOLAR
|
BIPOLAR
|
| Temperature Grade |
MILITARY
|
COMMERCIAL
|
| Terminal Finish |
Tin/Lead (Sn/Pb)
|
NICKEL PALLADIUM GOLD
|
| Terminal Form |
THROUGH-HOLE
|
GULL WING
|
| Terminal Pitch |
2.54 mm
|
1.27 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Base Number Matches |
8
|
2
|
| Pbfree Code |
|
Yes
|
| Part Package Code |
|
SOIC
|
| Pin Count |
|
8
|
| Average Bias Current-Max (IIB) |
|
0.01 µA
|
| Common-mode Reject Ratio-Nom |
|
86 dB
|
| Length |
|
4.9 mm
|
| Moisture Sensitivity Level |
|
1
|
| Neg Supply Voltage Limit-Max |
|
-18 V
|
| Neg Supply Voltage-Nom (Vsup) |
|
-15 V
|
| Peak Reflow Temperature (Cel) |
|
260
|
| Seated Height-Max |
|
1.75 mm
|
| Slew Rate-Nom |
|
3.5 V/us
|
| Supply Voltage Limit-Max |
|
18 V
|
| Supply Voltage-Nom (Vsup) |
|
15 V
|
| Time@Peak Reflow Temperature-Max (s) |
|
NOT SPECIFIED
|
| Unity Gain BW-Nom |
|
1000
|
| Width |
|
3.9 mm
|
|
|
|
Compare TL062CDG4 with alternatives