LM108AF
vs
M38510/10104BPA
feature comparison
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
ADVANCED MICRO DEVICES INC
|
MOTOROLA SEMICONDUCTOR PRODUCTS
|
| Part Package Code |
DFP
|
|
| Package Description |
HERMETIC SEALED, FP-10
|
DIP, DIP8,.3
|
| Pin Count |
10
|
|
| Reach Compliance Code |
unknown
|
unknown
|
| ECCN Code |
EAR99
|
|
| HTS Code |
8542.33.00.01
|
|
| Amplifier Type |
OPERATIONAL AMPLIFIER
|
OPERATIONAL AMPLIFIER
|
| Architecture |
VOLTAGE-FEEDBACK
|
VOLTAGE-FEEDBACK
|
| Average Bias Current-Max (IIB) |
0.003 µA
|
|
| Common-mode Reject Ratio-Nom |
110 dB
|
|
| Frequency Compensation |
NO
|
NO
|
| Input Offset Voltage-Max |
1000 µV
|
1000 µV
|
| JESD-30 Code |
R-XDFP-F10
|
R-XDIP-T8
|
| JESD-609 Code |
e0
|
e0
|
| Length |
6.1595 mm
|
|
| Low-Offset |
NO
|
NO
|
| Neg Supply Voltage-Nom (Vsup) |
-20 V
|
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
10
|
8
|
| Operating Temperature-Max |
125 °C
|
125 °C
|
| Operating Temperature-Min |
-55 °C
|
-55 °C
|
| Package Body Material |
UNSPECIFIED
|
CERAMIC
|
| Package Code |
DFP
|
DIP
|
| Package Equivalence Code |
FL10,.3
|
DIP8,.3
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
FLATPACK
|
IN-LINE
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Screening Level |
MIL-STD-883 Class C
|
38535Q/M;38534H;883B
|
| Seated Height-Max |
2.032 mm
|
|
| Supply Current-Max |
0.6 mA
|
|
| Supply Voltage-Nom (Vsup) |
20 V
|
|
| Surface Mount |
YES
|
NO
|
| Technology |
BIPOLAR
|
BIPOLAR
|
| Temperature Grade |
MILITARY
|
MILITARY
|
| Terminal Finish |
Tin/Lead (Sn/Pb)
|
Tin/Lead (Sn/Pb)
|
| Terminal Form |
FLAT
|
THROUGH-HOLE
|
| Terminal Pitch |
1.27 mm
|
2.54 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Width |
6.35 mm
|
|
| Base Number Matches |
7
|
11
|
| Bias Current-Max (IIB) @25C |
|
0.002 µA
|
| Power Supplies |
|
+-5/+-20 V
|
| Slew Rate-Min |
|
0.05 V/us
|
| Supply Voltage Limit-Max |
|
22 V
|
| Voltage Gain-Min |
|
20000
|
|
|
|
Compare LM108AF with alternatives