LM108AN vs M38510/10104BPA feature comparison

LM108AN NXP Semiconductors

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M38510/10104BPA Micross Components

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Part Life Cycle Code Obsolete Active
Ihs Manufacturer SIGNETICS CORP MICROSS COMPONENTS
Part Package Code DIP DIP
Package Description , DIP, DIP8,.3
Pin Count 8 8
Reach Compliance Code unknown compliant
ECCN Code EAR99 EAR99
HTS Code 8542.33.00.01 8542.33.00.01
Amplifier Type OPERATIONAL AMPLIFIER OPERATIONAL AMPLIFIER
JESD-30 Code R-PDIP-T8 R-CDIP-T8
Neg Supply Voltage Limit-Max -20 V -22 V
Neg Supply Voltage-Nom (Vsup) -15 V -10 V
Number of Functions 1 1
Number of Terminals 8 8
Package Body Material PLASTIC/EPOXY CERAMIC, METAL-SEALED COFIRED
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Qualification Status Not Qualified Not Qualified
Supply Voltage Limit-Max 20 V 22 V
Supply Voltage-Nom (Vsup) 15 V 10 V
Surface Mount NO NO
Technology BIPOLAR BIPOLAR
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Position DUAL DUAL
Base Number Matches 2 2
Architecture VOLTAGE-FEEDBACK
Average Bias Current-Max (IIB) 0.003 µA
Bias Current-Max (IIB) @25C 0.002 µA
Frequency Compensation NO
Input Offset Voltage-Max 1000 µV
JESD-609 Code e0
Low-Offset NO
Operating Temperature-Max 125 °C
Operating Temperature-Min -55 °C
Package Code DIP
Package Equivalence Code DIP8,.3
Screening Level MIL-PRF-38535 Class B
Slew Rate-Min 0.05 V/us
Temperature Grade MILITARY
Terminal Finish TIN LEAD
Terminal Pitch 2.54 mm
Voltage Gain-Min 20000

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Compare M38510/10104BPA with alternatives