LM158AH-SMD
vs
JM38510/10103BGA
feature comparison
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Transferred
|
Active
|
| Ihs Manufacturer |
NATIONAL SEMICONDUCTOR CORP
|
ON SEMICONDUCTOR
|
| Part Package Code |
BCY
|
|
| Package Description |
, CAN8,.2
|
|
| Pin Count |
8
|
|
| Reach Compliance Code |
not_compliant
|
unknown
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.33.00.01
|
8542.33.00.01
|
| Amplifier Type |
OPERATIONAL AMPLIFIER
|
OPERATIONAL AMPLIFIER
|
| Architecture |
VOLTAGE-FEEDBACK
|
VOLTAGE-FEEDBACK
|
| Average Bias Current-Max (IIB) |
0.001 µA
|
|
| Bias Current-Max (IIB) @25C |
0.05 µA
|
0.075 µA
|
| Frequency Compensation |
YES
|
NO
|
| Input Offset Voltage-Max |
4000 µV
|
3000 µV
|
| JESD-30 Code |
O-MBCY-W8
|
O-MBCY-W8
|
| JESD-609 Code |
e0
|
|
| Low-Offset |
NO
|
NO
|
| Moisture Sensitivity Level |
1
|
|
| Number of Functions |
2
|
1
|
| Number of Terminals |
8
|
8
|
| Operating Temperature-Max |
125 °C
|
125 °C
|
| Operating Temperature-Min |
-55 °C
|
-55 °C
|
| Package Body Material |
METAL
|
METAL
|
| Package Equivalence Code |
CAN8,.2
|
CAN8,.2
|
| Package Shape |
ROUND
|
ROUND
|
| Package Style |
CYLINDRICAL
|
CYLINDRICAL
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Screening Level |
MIL-STD-883
|
38535Q/M;38534H;883B
|
| Supply Current-Max |
4 mA
|
3.5 mA
|
| Supply Voltage Limit-Max |
32 V
|
22 V
|
| Supply Voltage-Nom (Vsup) |
5 V
|
|
| Surface Mount |
NO
|
|
| Technology |
BIPOLAR
|
BIPOLAR
|
| Temperature Grade |
MILITARY
|
MILITARY
|
| Terminal Finish |
Tin/Lead (Sn63Pb37)
|
|
| Terminal Form |
WIRE
|
WIRE
|
| Terminal Position |
BOTTOM
|
BOTTOM
|
| Time@Peak Reflow Temperature-Max (s) |
40
|
|
| Unity Gain BW-Nom |
1000
|
|
| Voltage Gain-Min |
25000
|
10000
|
| Base Number Matches |
2
|
11
|
| Slew Rate-Min |
|
0.3 V/us
|
|
|
|
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