LM158AN
vs
LM258AWYST
feature comparison
| Pbfree Code |
Yes
|
|
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
STMICROELECTRONICS
|
STMICROELECTRONICS
|
| Part Package Code |
DIP
|
MSOP
|
| Package Description |
DIP, DIP8,.3
|
TSSOP, TSSOP8,.19
|
| Pin Count |
8
|
8
|
| Reach Compliance Code |
compliant
|
unknown
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.33.00.01
|
8542.33.00.01
|
| Amplifier Type |
OPERATIONAL AMPLIFIER
|
OPERATIONAL AMPLIFIER
|
| Architecture |
VOLTAGE-FEEDBACK
|
VOLTAGE-FEEDBACK
|
| Average Bias Current-Max (IIB) |
0.1 µA
|
0.1 µA
|
| Bias Current-Max (IIB) @25C |
0.05 µA
|
0.05 µA
|
| Common-mode Reject Ratio-Nom |
85 dB
|
85 dB
|
| Frequency Compensation |
YES
|
YES
|
| Input Offset Voltage-Max |
4000 µV
|
4000 µV
|
| JESD-30 Code |
R-PDIP-T8
|
S-PDSO-G8
|
| JESD-609 Code |
e3
|
|
| Low-Offset |
NO
|
NO
|
| Number of Functions |
2
|
2
|
| Number of Terminals |
8
|
8
|
| Operating Temperature-Max |
125 °C
|
70 °C
|
| Operating Temperature-Min |
-55 °C
|
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
DIP
|
TSSOP
|
| Package Equivalence Code |
DIP8,.3
|
TSSOP8,.19
|
| Package Shape |
RECTANGULAR
|
SQUARE
|
| Package Style |
IN-LINE
|
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
5.08 mm
|
1.1 mm
|
| Slew Rate-Min |
0.3 V/us
|
0.3 V/us
|
| Slew Rate-Nom |
0.6 V/us
|
0.6 V/us
|
| Supply Current-Max |
1.2 mA
|
2 mA
|
| Supply Voltage Limit-Max |
32 V
|
32 V
|
| Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
| Surface Mount |
NO
|
YES
|
| Technology |
BIPOLAR
|
BIPOLAR
|
| Temperature Grade |
MILITARY
|
COMMERCIAL
|
| Terminal Finish |
MATTE TIN
|
|
| Terminal Form |
THROUGH-HOLE
|
GULL WING
|
| Terminal Pitch |
2.54 mm
|
0.65 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Unity Gain BW-Nom |
1100
|
1100
|
| Voltage Gain-Min |
25000
|
25000
|
| Width |
7.62 mm
|
3 mm
|
| Base Number Matches |
1
|
1
|
| Length |
|
3 mm
|
| Low-Bias |
|
NO
|
| Micropower |
|
YES
|
| Packing Method |
|
TAPE AND REEL
|
| Peak Reflow Temperature (Cel) |
|
NOT SPECIFIED
|
| Power |
|
NO
|
| Programmable Power |
|
NO
|
| Screening Level |
|
AEC-Q100
|
| Time@Peak Reflow Temperature-Max (s) |
|
NOT SPECIFIED
|
| Wideband |
|
NO
|
|
|
|
Compare LM158AN with alternatives
Compare LM258AWYST with alternatives