LM158J vs LM158JGB feature comparison

LM158J National Semiconductor Corporation

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LM158JGB Rochester Electronics LLC

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Rohs Code No No
Part Life Cycle Code Transferred Active
Ihs Manufacturer NATIONAL SEMICONDUCTOR CORP ROCHESTER ELECTRONICS INC
Part Package Code DIP DIP
Package Description CERDIP-8 DIP,
Pin Count 8 8
Reach Compliance Code not_compliant unknown
ECCN Code EAR99
HTS Code 8542.33.00.01
Amplifier Type OPERATIONAL AMPLIFIER OPERATIONAL AMPLIFIER
Architecture VOLTAGE-FEEDBACK
Average Bias Current-Max (IIB) 0.03 µA 0.3 µA
Bias Current-Max (IIB) @25C 0.05 µA
Common-mode Reject Ratio-Min 70 dB
Common-mode Reject Ratio-Nom 85 dB 80 dB
Frequency Compensation YES
Input Offset Voltage-Max 7000 µV 7000 µV
JESD-30 Code R-GDIP-T8 R-GDIP-T8
JESD-609 Code e0
Low-Offset NO
Moisture Sensitivity Level 1 NOT SPECIFIED
Neg Supply Voltage Limit-Max
Neg Supply Voltage-Nom (Vsup)
Number of Functions 2 2
Number of Terminals 8 8
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -55 °C
Package Body Material CERAMIC, GLASS-SEALED CERAMIC, GLASS-SEALED
Package Code DIP DIP
Package Equivalence Code DIP8,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Packing Method RAIL
Peak Reflow Temperature (Cel) 260 NOT SPECIFIED
Qualification Status Not Qualified
Seated Height-Max 5.08 mm 5.08 mm
Slew Rate-Nom 0.5 V/us 0.3 V/us
Supply Current-Max 2 mA
Supply Voltage Limit-Max 32 V 32 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology BIPOLAR BIPOLAR
Temperature Grade MILITARY MILITARY
Terminal Finish Tin/Lead (Sn/Pb) NOT SPECIFIED
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 40 NOT SPECIFIED
Unity Gain BW-Nom 1000 700
Voltage Gain-Min 50000
Width 7.62 mm 7.62 mm
Base Number Matches 6 1
Pbfree Code No
Length 9.58 mm

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