LM211N
vs
LM211F
feature comparison
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
NXP SEMICONDUCTORS
|
ADVANCED MICRO DEVICES INC
|
| Part Package Code |
DIP
|
DFP
|
| Package Description |
0.300 INCH, PLASTIC, MO-001, SC-504, SOT-97, DIP-8
|
CERAMIC, FP-10
|
| Pin Count |
8
|
10
|
| Reach Compliance Code |
unknown
|
unknown
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Amplifier Type |
COMPARATOR
|
COMPARATOR
|
| Average Bias Current-Max (IIB) |
0.15 µA
|
0.15 µA
|
| Bias Current-Max (IIB) @25C |
0.01 µA
|
|
| Input Offset Voltage-Max |
4000 µV
|
4000 µV
|
| JESD-30 Code |
R-PDIP-T8
|
R-CDFP-F10
|
| Length |
9.5 mm
|
|
| Moisture Sensitivity Level |
1
|
|
| Neg Supply Voltage Limit-Max |
-18 V
|
-18 V
|
| Neg Supply Voltage-Nom (Vsup) |
-15 V
|
-15 V
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
8
|
10
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-25 °C
|
-25 °C
|
| Output Type |
OPEN-COLLECTOR
|
OPEN-COLLECTOR/OPEN-EMITTER
|
| Package Body Material |
PLASTIC/EPOXY
|
CERAMIC, METAL-SEALED COFIRED
|
| Package Code |
DIP
|
DFP
|
| Package Equivalence Code |
DIP8,.3
|
FL10,.3
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
IN-LINE
|
FLATPACK
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Response Time-Nom |
200 ns
|
200 ns
|
| Seated Height-Max |
4.2 mm
|
|
| Supply Current-Max |
6 mA
|
6 mA
|
| Supply Voltage Limit-Max |
18 V
|
18 V
|
| Supply Voltage-Nom (Vsup) |
15 V
|
15 V
|
| Surface Mount |
NO
|
YES
|
| Technology |
BIPOLAR
|
BIPOLAR
|
| Temperature Grade |
OTHER
|
OTHER
|
| Terminal Form |
THROUGH-HOLE
|
FLAT
|
| Terminal Pitch |
2.54 mm
|
1.27 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Width |
7.62 mm
|
|
| Base Number Matches |
2
|
2
|
| JESD-609 Code |
|
e0
|
| Terminal Finish |
|
TIN LEAD
|
|
|
|
Compare LM211N with alternatives
Compare LM211F with alternatives