LM211PWG4
vs
LM2111D/883B
feature comparison
| Pbfree Code |
Yes
|
|
| Rohs Code |
Yes
|
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
TEXAS INSTRUMENTS INC
|
RAYTHEON SEMICONDUCTOR
|
| Part Package Code |
SOIC
|
|
| Package Description |
TSSOP, TSSOP8,.25
|
,
|
| Pin Count |
8
|
|
| Reach Compliance Code |
unknown
|
unknown
|
| ECCN Code |
EAR99
|
|
| HTS Code |
8542.39.00.01
|
|
| Amplifier Type |
COMPARATOR
|
COMPARATOR
|
| Average Bias Current-Max (IIB) |
0.15 µA
|
0.1 µA
|
| Bias Current-Max (IIB) @25C |
0.1 µA
|
|
| Input Offset Voltage-Max |
4000 µV
|
3000 µV
|
| JESD-30 Code |
R-PDSO-G8
|
R-GDIP-T16
|
| JESD-609 Code |
e4
|
|
| Length |
4.4 mm
|
|
| Moisture Sensitivity Level |
1
|
|
| Neg Supply Voltage Limit-Max |
-18 V
|
-18 V
|
| Neg Supply Voltage-Nom (Vsup) |
-15 V
|
-15 V
|
| Number of Functions |
1
|
2
|
| Number of Terminals |
8
|
16
|
| Operating Temperature-Max |
85 °C
|
125 °C
|
| Operating Temperature-Min |
-40 °C
|
-55 °C
|
| Output Type |
OPEN-COLLECTOR/OPEN-EMITTER
|
|
| Package Body Material |
PLASTIC/EPOXY
|
CERAMIC, GLASS-SEALED
|
| Package Code |
TSSOP
|
|
| Package Equivalence Code |
TSSOP8,.25
|
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
IN-LINE
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Response Time-Nom |
115 ns
|
200 ns
|
| Seated Height-Max |
1.2 mm
|
|
| Supply Current-Max |
7.5 mA
|
6 mA
|
| Supply Voltage Limit-Max |
18 V
|
18 V
|
| Supply Voltage-Nom (Vsup) |
15 V
|
15 V
|
| Surface Mount |
YES
|
NO
|
| Technology |
BIPOLAR
|
BIPOLAR
|
| Temperature Grade |
INDUSTRIAL
|
MILITARY
|
| Terminal Finish |
NICKEL PALLADIUM GOLD
|
|
| Terminal Form |
GULL WING
|
THROUGH-HOLE
|
| Terminal Pitch |
0.65 mm
|
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
|
| Width |
3 mm
|
|
| Base Number Matches |
1
|
1
|
|
|
|
Compare LM211PWG4 with alternatives
Compare LM2111D/883B with alternatives