LM224AJ/NOPB
vs
LF147J/883
feature comparison
| Rohs Code |
Yes
|
No
|
| Part Life Cycle Code |
Obsolete
|
Transferred
|
| Ihs Manufacturer |
NATIONAL SEMICONDUCTOR CORP
|
NATIONAL SEMICONDUCTOR CORP
|
| Package Description |
DIP,
|
CERAMIC, DIP-14
|
| Reach Compliance Code |
compliant
|
not_compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.33.00.01
|
8542.33.00.01
|
| Amplifier Type |
OPERATIONAL AMPLIFIER
|
OPERATIONAL AMPLIFIER
|
| Average Bias Current-Max (IIB) |
0.1 µA
|
0.0002 µA
|
| Common-mode Reject Ratio-Min |
70 dB
|
80 dB
|
| Common-mode Reject Ratio-Nom |
85 dB
|
80 dB
|
| Input Offset Voltage-Max |
4000 µV
|
5000 µV
|
| JESD-30 Code |
R-GDIP-T14
|
R-GDIP-T14
|
| Length |
19.43 mm
|
19.304 mm
|
| Moisture Sensitivity Level |
1
|
1
|
| Neg Supply Voltage Limit-Max |
|
-22 V
|
| Neg Supply Voltage-Nom (Vsup) |
|
-20 V
|
| Number of Functions |
4
|
4
|
| Number of Terminals |
14
|
14
|
| Operating Temperature-Max |
85 °C
|
125 °C
|
| Operating Temperature-Min |
-25 °C
|
-55 °C
|
| Package Body Material |
CERAMIC, GLASS-SEALED
|
CERAMIC, GLASS-SEALED
|
| Package Code |
DIP
|
DIP
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
IN-LINE
|
IN-LINE
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
5.08 mm
|
5.08 mm
|
| Slew Rate-Nom |
0.5 V/us
|
13 V/us
|
| Supply Voltage Limit-Max |
32 V
|
22 V
|
| Supply Voltage-Nom (Vsup) |
5 V
|
20 V
|
| Surface Mount |
NO
|
NO
|
| Technology |
BIPOLAR
|
BIFET
|
| Temperature Grade |
OTHER
|
MILITARY
|
| Terminal Form |
THROUGH-HOLE
|
THROUGH-HOLE
|
| Terminal Pitch |
2.54 mm
|
2.54 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Unity Gain BW-Nom |
1000
|
4000
|
| Voltage Gain-Min |
50000
|
25000
|
| Width |
7.62 mm
|
7.62 mm
|
| Base Number Matches |
1
|
2
|
| Part Package Code |
|
DIP
|
| Pin Count |
|
14
|
| Architecture |
|
VOLTAGE-FEEDBACK
|
| Bias Current-Max (IIB) @25C |
|
0.0002 µA
|
| Frequency Compensation |
|
YES
|
| Input Offset Current-Max (IIO) |
|
0.025 µA
|
| JESD-609 Code |
|
e0
|
| Low-Bias |
|
YES
|
| Low-Offset |
|
NO
|
| Package Equivalence Code |
|
DIP14,.3
|
| Packing Method |
|
RAIL
|
| Peak Reflow Temperature (Cel) |
|
260
|
| Screening Level |
|
MIL-STD-883
|
| Slew Rate-Min |
|
8 V/us
|
| Supply Current-Max |
|
11 mA
|
| Terminal Finish |
|
TIN LEAD
|
| Time@Peak Reflow Temperature-Max (s) |
|
40
|
|
|
|
Compare LM224AJ/NOPB with alternatives
Compare LF147J/883 with alternatives