LM224J/NOPB vs LM7171BIMX feature comparison

LM224J/NOPB National Semiconductor Corporation

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LM7171BIMX National Semiconductor Corporation

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Rohs Code Yes No
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer NATIONAL SEMICONDUCTOR CORP NATIONAL SEMICONDUCTOR CORP
Part Package Code DIP SOIC
Package Description CERDIP-14 0.150 INCH, SOIC-8
Pin Count 14 8
Reach Compliance Code compliant not_compliant
ECCN Code EAR99 EAR99
HTS Code 8542.33.00.01 8542.33.00.01
Amplifier Type OPERATIONAL AMPLIFIER OPERATIONAL AMPLIFIER
Average Bias Current-Max (IIB) 0.3 µA 10 µA
Common-mode Reject Ratio-Min 70 dB
Common-mode Reject Ratio-Nom 85 dB 104 dB
Input Offset Voltage-Max 7000 µV 3500 µV
JESD-30 Code R-GDIP-T14 R-PDSO-G8
Length 19.43 mm 4.9 mm
Moisture Sensitivity Level 1 1
Neg Supply Voltage Limit-Max -18 V
Neg Supply Voltage-Nom (Vsup) -5 V
Number of Functions 4 1
Number of Terminals 14 8
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -25 °C -40 °C
Package Body Material CERAMIC, GLASS-SEALED PLASTIC/EPOXY
Package Code DIP SOP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE SMALL OUTLINE
Peak Reflow Temperature (Cel) 260 235
Qualification Status Not Qualified Not Qualified
Seated Height-Max 5.08 mm 1.75 mm
Slew Rate-Nom 0.5 V/us 950 V/us
Supply Voltage Limit-Max 32 V 18 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO YES
Technology BIPOLAR BIPOLAR
Temperature Grade OTHER INDUSTRIAL
Terminal Form THROUGH-HOLE GULL WING
Terminal Pitch 2.54 mm 1.27 mm
Terminal Position DUAL DUAL
Unity Gain BW-Nom 1000 125000
Voltage Gain-Min 50000 2200
Width 7.62 mm 3.9 mm
Base Number Matches 1 2
Architecture VOLTAGE-FEEDBACK
Bias Current-Max (IIB) @25C 10 µA
Frequency Compensation YES (AVCL>=2)
JESD-609 Code e0
Low-Bias NO
Low-Offset NO
Micropower NO
Package Equivalence Code SOP8,.25
Packing Method TAPE AND REEL
Power NO
Programmable Power NO
Supply Current-Max 9.5 mA
Terminal Finish Tin/Lead (Sn/Pb)
Time@Peak Reflow Temperature-Max (s) 30
Wideband YES

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